SPSB081C3 STMicroelectronics Integrated Circuit (Quad Flat No-Lead) In Stock
SPSB081C3 is an automotive power management IC from STMicroelectronics integrating LIN and CAN-FD transceivers, designed for vehicle body and chassis ECUs operating from 8 V to 36 V automotive battery supplies in a compact QFN package with worldwide shipping.
- Manufacturer
- STMicroelectronics
- Package
- Quad Flat No-Lead
- Pin Count
- 33
- Lifecycle
- ACTIVE
- Datasheet
- SPSB081C3 Datasheet PDF
- Category
- Integrated Circuit
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SPSB081C3?
- Integrated LIN and CAN-FD transceivers in a single IC reducing component count for multi-protocol automotive network nodes
- Automotive-grade design supporting 8 V to 36 V supply range for robust operation across vehicle battery transient conditions
- Quad Flat No-Lead (QFN) package providing low thermal resistance for automotive under-hood temperature environments up to 125°C
- Combined power management and communication interface reducing PCB area and BOM cost in automotive ECU designs
What is SPSB081C3 used for?
SPSB081C3 is designed for automotive body electronics, chassis control units, and smart actuator modules that require both power management and dual-protocol communication on a single chip. Its integration of LIN and CAN-FD makes it ideal for door control modules, seat control units, and HVAC controllers that interface with both low-speed LIN sub-networks and high-speed CAN-FD backbone networks. The automotive-grade construction supports deployment in engine compartment ECUs and exterior lighting controllers operating across the full -40°C to 125°C automotive temperature range.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SPSB081C3 datasheet?
SPSB081C3 Datasheet DownloadOfficial datasheet from STMicroelectronics
What are equivalent replacements for SPSB081C3?
Compatible alternatives and drop-in replacements for SPSB081C3:
Frequently Asked Questions
Which automotive network topologies can SPSB081C3 support with its dual LIN and CAN-FD interface?
SPSB081C3 supports both LIN (Local Interconnect Network) operating at up to 20 kbps and CAN-FD (Controller Area Network with Flexible Data-rate) at up to 8 Mbps data phase. This dual-protocol capability enables it to bridge LIN sub-networks (used for sensors and actuators) to CAN-FD backbone networks (used for ECU-to-ECU communication), making it suitable for gateway nodes in body electronics architectures requiring ISO 17987 LIN compliance.
How does SPSB081C3 handle automotive battery voltage transients above the nominal 12 V supply?
Automotive battery rails can experience transients ranging from -40 V to +40 V due to load dump and switching events per ISO 7637 standards. SPSB081C3's automotive power management section is rated for an 8 V to 36 V operating range with robust transient handling, protecting downstream circuitry from voltage spikes. The integrated power management regulates stable output voltages for microcontrollers and sensors even during cranking voltage drops to approximately 6 V–8 V.
What thermal performance does the QFN package of SPSB081C3 provide in high-temperature automotive environments?
The Quad Flat No-Lead (QFN) package used by SPSB081C3 features an exposed thermal pad on the bottom providing a low junction-to-board thermal resistance (typically 20–35°C/W depending on pad size), enabling effective heat dissipation in automotive environments up to 125°C ambient. Compared to standard SOIC packages with thermal resistance above 70°C/W, the QFN package allows SPSB081C3 to handle higher power dissipation levels required in automotive under-hood locations.
When is SPSB081C3 a more cost-effective choice than using separate LIN and CAN-FD transceiver ICs?
SPSB081C3 integrates power management, a LIN transceiver, and a CAN-FD transceiver in a single package, replacing at minimum 3 separate ICs that would each require their own decoupling capacitors and passive components. In bill-of-materials analysis for a production ECU, this integration typically reduces component count by 8–12 parts per node and saves 50–80 mm² of PCB area, making SPSB081C3 more cost-effective for high-volume automotive applications where these savings multiply across thousands of units.
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Why Buy from FindMyChip
About STMicroelectronics
STMicroelectronics is a global semiconductor leader serving customers across the spectrum of electronics applications. ST's products are found in a wide range of applications including automotive, industrial, personal electronics, and communications.
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
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