SN74SSTVF16859S8G3 Texas Instruments Integrated Circuit (Quad Flat No-Lead) In Stock
SN74SSTVF16859S8G3 is a 13-bit registered buffer and clock driver from Texas Instruments in a 56-pin QFN package. It operates at up to 500 MHz and provides 16 mA sink current per output, designed for high-speed DDR memory bus buffering. Available from stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Quad Flat No-Lead
- Pin Count
- 56
- Lifecycle
- OBSOLETE
- Datasheet
- SN74SSTVF16859S8G3 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 70.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SN74SSTVF16859S8G3?
- 500 MHz maximum clock frequency supporting high-speed DDR2/DDR3 register and address buffer applications
- 13-bit registered D flip-flop outputs with 16 mA sink current for robust signal integrity on memory buses
- 56-pin QFN package with exposed thermal pad minimizes PCB footprint in dense server and networking designs
What is SN74SSTVF16859S8G3 used for?
SN74SSTVF16859S8G3 is intended for use as a registered address/command buffer on DDR2 and DDR3 SDRAM DIMMs in server memory modules, workstations, and high-performance embedded computing platforms. Its 500 MHz operation and SSTV-family signal levels ensure clean edge rates and low additive jitter on memory buses, enabling reliable system operation at memory clock frequencies above 400 MHz.
What are the specifications of SN74SSTVF16859S8G3?
| YTEOL | 0 |
| Family | SSTV |
| JESD-30 Code | S-PQCC-N56 |
| JESD-609 Code | e3 |
| Logic IC Type | D FLIP-FLOP |
| Max Frequency@Nom-Sup | 500000000Hz |
| Max I(ol) | 0.016A |
| Number of Bits | 13 |
| Number of Functions | 1 |
| Output Polarity | TRUE |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | LCC56,.31SQ,20 |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Packing Method | TR |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supply Current-Max (ICC) | 25mA |
| Prop. Delay@Nom-Sup | 2.5ns |
| Propagation Delay (tpd) | 2.5ns |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 2.7V |
| Supply Voltage-Min (Vsup) | 2.5V |
| Supply Voltage-Nom (Vsup) | 2.6V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | MATTE TIN |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.5mm |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Trigger Type | POSITIVE EDGE |
| fmax-Min | 500MHz |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| HTS Code | 8542.39.00.60 |
Where can I find the SN74SSTVF16859S8G3 datasheet?
SN74SSTVF16859S8G3 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for SN74SSTVF16859S8G3?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does SN74SSTVF16859S8G3 maintain signal integrity on DDR3 address buses at high clock frequencies?
SN74SSTVF16859S8G3 registers all 13 input bits on the rising clock edge and re-drives them with matched propagation delays typically under 400 ps skew, operating at up to 500 MHz. This re-clocking eliminates accumulated jitter from the memory controller traces before the signal reaches each DRAM, maintaining setup and hold margins above 100 ps even on 8-rank DIMMs.
What output drive strength does SN74SSTVF16859S8G3 provide and how many DDR3 devices can it fan out to?
Each output sinks 16 mA and sources a comparable current in the SSTV voltage range. On a standard DDR3 address bus with typical 30 Ω stub termination, SN74SSTVF16859S8G3 can drive 8 to 18 DRAM devices depending on bus topology, providing sufficient current to maintain valid voltage levels at 1.5 V VDDQ with less than 100 mV droop.
Why would a memory module designer choose SN74SSTVF16859S8G3 over an unbuffered buffer in a high-density DIMM design?
In registered DIMMs with 16 or more DRAM chips, the address bus fanout of 16 pF per chip would exceed the DDR3 spec without a registered buffer. SN74SSTVF16859S8G3 absorbs the full load in a single 56-pin QFN package, re-driving clean edges to each rank. This approach reduces address bus power compared to discrete unbuffered solutions by eliminating stub reflections and cutting termination dissipation by approximately 30%.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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