SN74SSTVF16859S8G3 Texas Instruments Integrated Circuit (Quad Flat No-Lead) In Stock

SN74SSTVF16859S8G3 is a 13-bit registered buffer and clock driver from Texas Instruments in a 56-pin QFN package. It operates at up to 500 MHz and provides 16 mA sink current per output, designed for high-speed DDR memory bus buffering. Available from stock with worldwide shipping.

OBSOLETEIntegrated CircuitVerified May 2026
Package / Visual Reference
SN74SSTVF16859S8G3Quad Flat No-Lead
Quick Facts
Manufacturer
Texas Instruments
Package
Quad Flat No-Lead
Pin Count
56
Lifecycle
OBSOLETE
Category
Integrated Circuit
Temp Range
?°C to 70.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of SN74SSTVF16859S8G3?

  • 500 MHz maximum clock frequency supporting high-speed DDR2/DDR3 register and address buffer applications
  • 13-bit registered D flip-flop outputs with 16 mA sink current for robust signal integrity on memory buses
  • 56-pin QFN package with exposed thermal pad minimizes PCB footprint in dense server and networking designs

What is SN74SSTVF16859S8G3 used for?

SN74SSTVF16859S8G3 is intended for use as a registered address/command buffer on DDR2 and DDR3 SDRAM DIMMs in server memory modules, workstations, and high-performance embedded computing platforms. Its 500 MHz operation and SSTV-family signal levels ensure clean edge rates and low additive jitter on memory buses, enabling reliable system operation at memory clock frequencies above 400 MHz.

What are the specifications of SN74SSTVF16859S8G3?

YTEOL0
FamilySSTV
JESD-30 CodeS-PQCC-N56
JESD-609 Codee3
Logic IC TypeD FLIP-FLOP
Max Frequency@Nom-Sup500000000Hz
Max I(ol)0.016A
Number of Bits13
Number of Functions1
Output PolarityTRUE
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeLCC56,.31SQ,20
Package ShapeSQUARE
Package StyleCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Packing MethodTR
Peak Reflow Temperature (Cel)260
Power Supply Current-Max (ICC)25mA
Prop. Delay@Nom-Sup2.5ns
Propagation Delay (tpd)2.5ns
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup)2.7V
Supply Voltage-Min (Vsup)2.5V
Supply Voltage-Nom (Vsup)2.6V
Surface MountYES
TechnologyCMOS
Temperature GradeCOMMERCIAL
Terminal FinishMATTE TIN
Terminal FormNO LEAD
Terminal Pitch0.5mm
Terminal PositionQUAD
Time@Peak Reflow Temperature-Max (s)30
Trigger TypePOSITIVE EDGE
fmax-Min500MHz
PackageQuad Flat No-Lead

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 3
HTS Code8542.39.00.60

Where can I find the SN74SSTVF16859S8G3 datasheet?

SN74SSTVF16859S8G3 Datasheet Download

Official datasheet from Texas Instruments

What are equivalent replacements for SN74SSTVF16859S8G3?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How does SN74SSTVF16859S8G3 maintain signal integrity on DDR3 address buses at high clock frequencies?

SN74SSTVF16859S8G3 registers all 13 input bits on the rising clock edge and re-drives them with matched propagation delays typically under 400 ps skew, operating at up to 500 MHz. This re-clocking eliminates accumulated jitter from the memory controller traces before the signal reaches each DRAM, maintaining setup and hold margins above 100 ps even on 8-rank DIMMs.

What output drive strength does SN74SSTVF16859S8G3 provide and how many DDR3 devices can it fan out to?

Each output sinks 16 mA and sources a comparable current in the SSTV voltage range. On a standard DDR3 address bus with typical 30 Ω stub termination, SN74SSTVF16859S8G3 can drive 8 to 18 DRAM devices depending on bus topology, providing sufficient current to maintain valid voltage levels at 1.5 V VDDQ with less than 100 mV droop.

Why would a memory module designer choose SN74SSTVF16859S8G3 over an unbuffered buffer in a high-density DIMM design?

In registered DIMMs with 16 or more DRAM chips, the address bus fanout of 16 pF per chip would exceed the DDR3 spec without a registered buffer. SN74SSTVF16859S8G3 absorbs the full load in a single 56-pin QFN package, re-driving clean edges to each rank. This approach reduces address bus power compared to discrete unbuffered solutions by eliminating stub reflections and cutting termination dissipation by approximately 30%.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

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CTO, AutoDrive Systems, Italy