SN74LVTH540NSRE4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
The SN74LVTH540NSRE4 is a 3.3V ABT octal bus buffer and line driver with 3-state outputs from Texas Instruments. It supports unidirectional data flow with dual active-low output enable, 50 pF load capacitance, and 64 mA sink current. Available in a 20-pin Small Outline package with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 20
- Lifecycle
- OBSOLETE
- Datasheet
- SN74LVTH540NSRE4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SN74LVTH540NSRE4?
- 3.3V LVT-family octal bus driver with 3-state outputs for multi-master bus sharing
- Dual active-low output enable (OE) for flexible bus control in bidirectional systems
- High output sink current of 64 mA (IOL) enabling robust bus drive capability
- 50 pF load capacitance rating for reliable signal integrity on loaded PCB traces
- Compact 20-pin SOIC package (R-PDSO-G20) for space-efficient board layouts
What is SN74LVTH540NSRE4 used for?
The SN74LVTH540NSRE4 is used in 3.3V digital systems to buffer and drive data buses in microprocessor, FPGA, and ASIC interfaces. Its 3-state outputs and dual enable controls make it ideal for memory bus expansion, address latching, and multi-board bus architectures. The device is commonly deployed in networking equipment, industrial controllers, and computing platforms where reliable high-current bus driving is required.
What are the specifications of SN74LVTH540NSRE4?
| Pbfree Code | Yes |
| YTEOL | 0 |
| Additional Feature | WITH DUAL OUTPUT ENABLE |
| Control Type | ENABLE LOW |
| Count Direction | UNIDIRECTIONAL |
| Family | LVT |
| JESD-30 Code | R-PDSO-G20 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | BUS DRIVER |
| Max I(ol) | 0.064A |
| Number of Bits | 8 |
| Number of Functions | 1 |
| Number of Ports | 2 |
| Output Characteristics | 3-STATE |
| Output Polarity | INVERTED |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOP20,.3 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Packing Method | TR |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Power Supply Current-Max (ICC) | 5mA |
| Prop. Delay@Nom-Sup | 3.8ns |
| Propagation Delay (tpd) | 4.6ns |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 2.7V |
| Supply Voltage-Nom (Vsup) | 3.3V |
| Surface Mount | YES |
| Technology | BICMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| HTS Code | 8542.39.00.60 |
Where can I find the SN74LVTH540NSRE4 datasheet?
SN74LVTH540NSRE4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for SN74LVTH540NSRE4?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Where does SN74LVTH540NSRE4 fit in a digital board design?
SN74LVTH540NSRE4 fits 3.3 V logic boards that need an octal bus buffer or line driver with 3-state outputs for controlled unidirectional signal paths.
Which electrical limits should engineers check before substitution?
Engineers should compare the 64 mA low-level output current, 50 pF load capacitance, active-low enable behavior, and 20-pin SO package against the original timing budget.
How should buyers verify the package and assembly match?
Buyers should confirm the NSR reel packaging, 20-pin small-outline footprint, Pb-free finish, and 3.3 V LVT logic family before approving alternate sourcing.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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