SN74LVC863ANSRE4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
SN74LVC863ANSRE4 is a 9-bit bidirectional bus transceiver from Texas Instruments in the LVC logic family with 3-state outputs and dual independent output enables. Supports 24 mA output sink current and independent control for each data direction in a 24-pin SOIC package. Available in stock worldwide with fast shipping.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 24
- Lifecycle
- OBSOLETE
- Datasheet
- SN74LVC863ANSRE4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SN74LVC863ANSRE4?
- 9-bit bidirectional data path with independent direction control allows flexible bus interface between processors and memory
- Dual independent output enables per direction provide fine-grained bus isolation control for complex multi-master designs
- LVC logic family supports 1.65 V to 3.6 V operation with 5 V tolerant inputs for mixed-voltage bus bridging
- 24 mA output sink current drives heavy bus loads reliably in high-fan-out backplane and board-level interconnects
What is SN74LVC863ANSRE4 used for?
The SN74LVC863ANSRE4 is used to interface bidirectional data buses between microprocessors, FPGAs, memories, and peripheral devices in embedded systems, server boards, and industrial controllers. Its independent output enables and 9-bit width make it ideal for address and data bus buffering, bus isolation, and level shifting between 3.3 V and 5 V logic domains.
What are the specifications of SN74LVC863ANSRE4?
| YTEOL | 0 |
| Additional Feature | WITH DUAL INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION |
| Control Type | INDEPENDENT CONTROL |
| Count Direction | BIDIRECTIONAL |
| Family | LVC/LCX/Z |
| JESD-30 Code | R-PDSO-G24 |
| Logic IC Type | BUS TRANSCEIVER |
| Max I(ol) | 0.024A |
| Number of Bits | 9 |
| Number of Functions | 1 |
| Number of Ports | 2 |
| Output Characteristics | 3-STATE |
| Output Polarity | TRUE |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOP24,.3 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Packing Method | TR |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Prop. Delay@Nom-Sup | 6.1ns |
| Propagation Delay (tpd) | 6.8ns |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 1.65V |
| Supply Voltage-Nom (Vsup) | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| HTS Code | 8542.39.00.60 |
Where can I find the SN74LVC863ANSRE4 datasheet?
SN74LVC863ANSRE4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for SN74LVC863ANSRE4?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which designs are a good fit for SN74LVC863ANSRE4 with 24 mA?
SN74LVC863ANSRE4 fits industrial, embedded, and repair-oriented electronic assemblies when the design needs 24 mA and 0.024 A. It is a practical choice when the BOM also matches the 24-pin SOIC footprint.
How should engineers check package compatibility for SN74LVC863ANSRE4?
Compare the PCB land pattern, height allowance, and assembly process against the 24-pin SOIC style. The 24 pins detail is the first check before approving a replacement.
What matters when sourcing SN74LVC863ANSRE4 as a replacement?
Confirm the same 24 mA, 0.024 A, manufacturer traceability, and lifecycle status before substituting it. Buyers should also verify stock for the exact 24-pin SOIC configuration.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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