SN74LVC2G07DCKRE4Alternatives & Equivalent Parts
About SN74LVC2G07DCKRE4
SN74LVC2G07DCKRE4 is a Integrated Circuit component manufactured by Texas Instruments. It comes in a SOT23 (6-Pin) package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
Specification Comparison
| Parameter | SN74LVC2G07DCKRE4Source | SN74LVC2G34DCKRE4 | SN74LVC2G07DCKTG4 | SN74LVC2G07DCKR | SN74LVC2G07DCK | SN74LVC2G07DCKT | SN74LVC2G34DCKR | SN74LVC2G34DCK3 |
|---|---|---|---|---|---|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package Type | SOT23 (6-Pin) | SOT23 (6-Pin) | SOT23 (6-Pin) | SOT23 (6-Pin) | SOT23 (6-Pin) | SOT23 (6-Pin) | SOT23 (6-Pin) | SOT23 (6-Pin) |
| Pin Count | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 |
| Temperature Range | -40.0°C ~ 125.0°C | -40.0°C ~ 125.0°C | -40.0°C ~ 125.0°C | -40.0°C ~ 125.0°C | -40.0°C ~ 85.0°C | -40.0°C ~ 125.0°C | -40.0°C ~ 125.0°C | -40.0°C ~ 85.0°C |
| Price | $0.2721 | $0.0653 | — | $0.0850 | $0.0543 | $0.0543 | $0.0675 | $0.3126 |
| Electrical Parameters | ||||||||
| Pbfree Code | Yes | Yes | Yes | Yes | — | Yes | Yes | — |
| YTEOL | 15 | 15 | 15 | 15 | 0 | 15 | 15 | 1 |
| Family | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 Code | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-G6 |
| JESD-609 Code | e4 | e4 | e4 | e3 | — | e4 | e3 | e6 |
| Load Capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | — | 50 pF | 50 pF | — |
| Logic IC Type | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER |
| Max I(ol) | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A |
| Number of Functions | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of Inputs | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Output Characteristics | OPEN-DRAIN | — | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | — | — |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP6,.08 | TSSOP6,.08 | TSSOP6,.08 | TSSOP6,.08 | TSSOP6,.08 | TSSOP6,.08 | TSSOP6,.08 | — |
| Package Shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Packing Method | TR | TR | TR | TR | — | TR | TR | — |
| Peak Reflow Temperature (Cel) | 260 | 260 | 260 | 260 | NOT SPECIFIED | 260 | 260 | 260 |
| Power Supply Current-Max (ICC) | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA |
| Prop. Delay@Nom-Sup | 3.7 ns | 4.1 ns | 3.7 ns | 8.6 ns | — | 3.7 ns | 4.1 ns | — |
| Propagation Delay (tpd) | 8.6 ns | 8.6 ns | 8.6 ns | 8.6 ns | 8.6 ns | 8.6 ns | 8.6 ns | 8.6 ns |
| Qualification Status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | — | Not Qualified | Not Qualified | — |
| Schmitt Trigger | NO | NO | NO | NO | — | NO | NO | — |
| Supply Voltage-Max (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Supply Voltage-Min (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| Supply Voltage-Nom (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Surface Mount | YES | YES | YES | YES | YES | YES | YES | YES |
| Technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature Grade | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin (Sn) | — | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin (Sn) | Tin/Bismuth (Sn/Bi) |
| Terminal Form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal Pitch | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| Terminal Position | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 | 30 | 30 | 30 | NOT SPECIFIED | 30 | 30 | 30 |
| ## SN74LVC2G07DCKR Alternates Showing results | — | — | — | Image | — | — | — | — |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
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Why Look for Alternatives?
Finding alternatives for SN74LVC2G07DCKRE4 is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating SN74LVC2G07DCKRE4 replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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Request Alternatives for SN74LVC2G07DCKRE4FAQ
What is equivalent to SN74LVC2G07DCKRE4?
Known equivalents for SN74LVC2G07DCKRE4 include SN74LVC2G34DCKRE4, SN74LVC2G07DCKTG4, SN74LVC2G07DCKR. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of SN74LVC2G07DCKRE4?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify SN74LVC2G07DCKRE4 alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.