SN74LVC1G66DBVRG4 Texas Instruments Integrated Circuit (SOT23 (5-Pin)) In Stock
The SN74LVC1G66DBVRG4 is a single-channel bilateral analog switch from Texas Instruments with 300MHz bandwidth and 42dB off-state isolation. It operates as an SPST switch in a compact SOT-23-5 package suitable for signal routing in portable devices. Available in stock worldwide with fast shipping from authorized distributors.
- Manufacturer
- Texas Instruments
- Package
- SOT23 (5-Pin)
- Pin Count
- 5
- Lifecycle
- OBSOLETE
- Datasheet
- SN74LVC1G66DBVRG4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 300MHz signal bandwidth enables high-frequency analog signal switching
- 42dB off-state isolation ensures minimal signal leakage between switch states
- Single SPST channel in ultra-compact SOT-23-5 package for space-saving designs
Applications
The SN74LVC1G66DBVRG4 is ideal for routing analog and digital signals in mobile phones, portable audio equipment, and battery-powered consumer devices. Its high bandwidth of 300MHz makes it suitable for RF and high-speed data path switching applications. The tiny SOT-23-5 package and LVC-level voltage compatibility allow integration into low-voltage mixed-signal circuits.
Specifications
| Pbfree Code | Yes |
| YTEOL | 0 |
| Analog IC - Other Type | SPST |
| Bandwidth-Nom | 300MHz |
| JESD-30 Code | R-PDSO-G5 |
| JESD-609 Code | e4 |
| Normal Position | NC |
| Number of Channels | 1 |
| Number of Functions | 1 |
| Off-state Isolation-Nom | 42dB |
| On-state Resistance Match-Nom | 12Ω |
| On-state Resistance-Max (Ron) | 20Ω |
| Output | SEPARATE OUTPUT |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSOP5,.11,37 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Signal Current-Max | 0.1A |
| Supply Current-Max (Isup) | 0.01mA |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage-Min (Vsup) | 1.65V |
| Supply Voltage-Nom (Vsup) | 2.3V |
| Surface Mount | YES |
| Switch-off Time-Max | 6.9ns |
| Switch-on Time-Max | 6.5ns |
| Switching | BREAK-BEFORE-MAKE |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.95mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | SOT23 (5-Pin) |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.01 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the bandwidth of the SN74LVC1G66DBVRG4 analog switch?
The SN74LVC1G66DBVRG4 offers a nominal bandwidth of 300MHz, making it capable of handling high-frequency analog signals in RF, audio, and broadband switching applications without significant signal degradation.
How many channels does the SN74LVC1G66DBVRG4 have?
The SN74LVC1G66DBVRG4 features a single channel configured as an SPST (Single Pole Single Throw) bilateral analog switch, allowing bidirectional signal flow in one signal path with a compact footprint.
What package does the SN74LVC1G66DBVRG4 use?
The SN74LVC1G66DBVRG4 is housed in a 5-pin SOT-23 package (JESD-30 code R-PDSO-G5), an extremely compact surface-mount package ideal for portable and space-constrained PCB designs. It is RoHS compliant and lead-free.
What is the off-state isolation of the SN74LVC1G66DBVRG4?
The SN74LVC1G66DBVRG4 provides 42dB nominal off-state isolation, ensuring that when the switch is open, signal leakage from the input to the output is minimized, critical for maintaining signal integrity in multiplexing applications.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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