SN74LVC1G19DBVRG4 Texas Instruments Integrated Circuit (SOT23 (6-Pin)) In Stock
SN74LVC1G19DBVRG4 is a single 1-to-2 decoder/demultiplexer from Texas Instruments in the LVC logic family. Features 3-state outputs, 50pF load capacitance, and 24mA output current in a 6-pin SOT-23 package. RoHS compliant and available worldwide for portable and low-voltage logic applications.
- Manufacturer
- Texas Instruments
- Package
- SOT23 (6-Pin)
- Pin Count
- 6
- Lifecycle
- OBSOLETE
- Datasheet
- SN74LVC1G19DBVRG4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SN74LVC1G19DBVRG4?
- Single 1-to-2 decoder/demultiplexer with 3-state outputs for bus-sharing and signal routing in compact designs
- LVC/LCX/Z logic family supports wide supply voltage range with low-voltage CMOS compatibility and high-speed switching
- Ultra-compact 6-pin SOT-23 package (R-PDSO-G6) minimizes PCB footprint for space-constrained portable electronics
- Lead-free JESD-609 e4 compliant with 24mA output sink current and 50pF load capacitance for versatile interfacing
What is SN74LVC1G19DBVRG4 used for?
The SN74LVC1G19DBVRG4 is ideal for signal routing, address decoding, and bus demultiplexing in low-power portable devices, IoT nodes, and battery-operated embedded systems. Its tiny SOT-23 footprint and LVC-family low-voltage operation make it well suited for use in smartphones, wearables, and space-constrained PCB designs requiring reliable 1-to-2 signal distribution.
What are the specifications of SN74LVC1G19DBVRG4?
| YTEOL | 0 |
| Family | LVC/LCX/Z |
| Input Conditioning | STANDARD |
| JESD-30 Code | R-PDSO-G6 |
| JESD-609 Code | e4 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | OTHER DECODER/DRIVER |
| Max I(ol) | 0.024A |
| Number of Functions | 1 |
| Output Characteristics | 3-STATE |
| Output Polarity | COMPLEMENTARY |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSOP6,.11,37 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| Packing Method | TR |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supply Current-Max (ICC) | 0.01mA |
| Prop. Delay@Nom-Sup | 5.2ns |
| Propagation Delay (tpd) | 16.1ns |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage-Min (Vsup) | 1.65V |
| Supply Voltage-Nom (Vsup) | 1.8V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.95mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | SOT23 (6-Pin) |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
Where can I find the SN74LVC1G19DBVRG4 datasheet?
SN74LVC1G19DBVRG4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for SN74LVC1G19DBVRG4?
Compatible alternatives and drop-in replacements for SN74LVC1G19DBVRG4:
Decoder/Driver, LVC/LCX/Z Series, Complementary Output, CMOS, PDSO6
Frequently Asked Questions
Which designs are a good fit for SN74LVC1G19DBVRG4 with 50 pF?
SN74LVC1G19DBVRG4 fits industrial, embedded, and repair-oriented electronic assemblies when the design needs 50 pF and 24 mA. It is a practical choice when the BOM also matches the 6-pin SOT-23 footprint.
How should engineers check package compatibility for SN74LVC1G19DBVRG4?
Compare the PCB land pattern, height allowance, and assembly process against the 6-pin SOT-23 style. The 6 pins detail is the first check before approving a replacement.
What matters when sourcing SN74LVC1G19DBVRG4 as a replacement?
Confirm the same 50 pF, 24 mA, manufacturer traceability, and lifecycle status before substituting it. Buyers should also verify stock for the exact 6-pin SOT-23 configuration.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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