SN74LS367ADG4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock

The SN74LS367ADG4 is a hex bus buffer and line driver with 3-state outputs in a 16-pin SOIC package, featuring two active-low enable groups that control six unidirectional channels. It operates from 4.75 V to 5.25 V with 24 mA output current and 45 pF load tolerance, used in TTL address and data bus buffering.

OBSOLETEIntegrated CircuitVerified May 2026
Package / Visual Reference
SN74LS367ADG4Small Outline Packages
Quick Facts
Manufacturer
Texas Instruments
Package
Small Outline Packages
Pin Count
16
Lifecycle
OBSOLETE
Category
Integrated Circuit
Temp Range
?°C to 70.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of SN74LS367ADG4?

  • Hex 6-channel bus buffer with 3-state outputs and active-low enable
  • Two independent enable groups for flexible bus segmentation
  • TTL supply range 4.75 V to 5.25 V with 24 mA output sink current
  • Unidirectional LS-family logic in a 16-pin SOIC package
  • 45 pF load capacitance rating for standard TTL bus lines
  • JESD-609 e4 lead-free construction for RoHS compliance

What is SN74LS367ADG4 used for?

The SN74LS367ADG4 is widely used in legacy TTL microprocessor systems to buffer 6-bit address or data lines, providing signal isolation and drive-current amplification for bus loads at 5 V. It fits naturally in prototyping boards and through-hole-friendly SOIC assemblies where LS-series compatibility is required. Industrial automation controllers and embedded educational platforms also use it to interface microcontroller I/O ports with shared TTL buses.

What are the specifications of SN74LS367ADG4?

Pbfree CodeYes
YTEOL0
Additional FeatureONE FUNCTION WITH TWO BITS
Control TypeENABLE LOW
Count DirectionUNIDIRECTIONAL
FamilyLS
JESD-30 CodeR-PDSO-G16
JESD-609 Codee4
Load Capacitance (CL)45pF
Logic IC TypeBUS DRIVER
Max I(ol)0.024A
Number of Bits6
Number of Functions1
Number of Ports2
Output Characteristics3-STATE
Output PolarityTRUE
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeSOP16,.25
Package ShapeRECTANGULAR
Package StyleSMALL OUTLINE
Packing MethodTUBE
Peak Reflow Temperature (Cel)260
Power Supply Current-Max (ICC)24mA
Prop. Delay@Nom-Sup22ns
Propagation Delay (tpd)40ns
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup)5.25V
Supply Voltage-Min (Vsup)4.75V
Supply Voltage-Nom (Vsup)5V
Surface MountYES
TechnologyTTL
Temperature GradeCOMMERCIAL
Terminal FinishNICKEL PALLADIUM GOLD
Terminal FormGULL WING
Terminal Pitch1.27mm
Terminal PositionDUAL
Time@Peak Reflow Temperature-Max (s)30
PackageSmall Outline Packages

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 1
HTS Code8542.39.00.60

Where can I find the SN74LS367ADG4 datasheet?

SN74LS367ADG4 Datasheet Download

Official datasheet from Texas Instruments

What are equivalent replacements for SN74LS367ADG4?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How are the enable pins on the SN74LS367ADG4 organized across its 6 buffer channels?

The 6 channels are divided into two groups: one enable controls 4 channels and a second enable controls the remaining 2 channels. Each enable is active-low, placing the associated outputs in the high-impedance 3-state when deasserted. This two-group architecture supports flexible bus partitioning in TTL systems operating from 4.75 V to 5.25 V.

What is the output drive current of each channel and what load capacitance is it rated for?

Each buffer output can sink up to 24 mA and source current consistent with LS-TTL logic, rated for a load capacitance of 45 pF. These parameters are sufficient to drive standard TTL bus lines with typical fanout requirements, maintaining valid logic levels across the 4.75 V to 5.25 V supply range.

When would a designer choose the SN74LS367ADG4 over the SN74LS244 octal buffer?

A designer would choose the SN74LS367ADG4 when exactly 6 buffered lines with two independent enable groups are needed in a 16-pin SOIC package, rather than 8 lines in the 20-pin SN74LS244. The hex arrangement is common in 6-bit address sub-bus designs and reduces pin count when all 8 channels of a larger octal device are not required.

Is the SN74LS367ADG4 suitable for replacement in boards that used the older 74LS367 DIP part?

Yes, the SN74LS367ADG4 is the surface-mount SOIC equivalent of the through-hole 74LS367 DIP. Both operate from 4.75 V to 5.25 V with identical logic function, 24 mA sink current, and 45 pF load capacitance ratings. An adapter or footprint redesign is required to move from the original 16-pin DIP to the 16-pin SOIC package during board respins.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

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Lead Time3-7 business days
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CTO, AutoDrive Systems, Italy