SN74HC574PWE4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
SN74HC574PWE4 is an octal edge-triggered D-type flip-flop with 3-state outputs by Texas Instruments. Key specs: 2 V to 6 V supply, 24 MHz max frequency, 20-pin TSSOP. From $0.35 in stock worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 20
- Lifecycle
- OBSOLETE
- Datasheet
- SN74HC574PWE4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SN74HC574PWE4?
- 8 edge-triggered D-type flip-flops with active-low 3-state output enable, allowing multiple devices to share a common 8-bit data bus without contention
- Maximum clock frequency of 24 MHz at nominal supply and 50 pF load enables reliable data latching in mid-speed bus interface and register bank designs
- HC CMOS technology with 6 mA output sink current and 2 V to 6 V supply range provides broad compatibility with 3.3 V and 5 V digital logic systems
- 20-pin TSSOP (PDSO-G20) package offers a compact SMD footprint ideal for dense PCB layouts in communications equipment and embedded control boards
What is SN74HC574PWE4 used for?
The SN74HC574PWE4 is widely used as an 8-bit data latch and bus register in microprocessor and microcontroller systems, where data must be captured on a rising clock edge and held stable while the CPU processes other bus transactions. Its 3-state outputs allow multiple SN74HC574 devices to drive the same 8-bit bus under separate enable controls, making it ideal for memory-mapped I/O expansion, address latching in multiplexed bus architectures, and output port drivers in industrial PLC backplanes. The 24 MHz operating frequency and TSSOP packaging also suit modern embedded computing boards where space and speed both matter.
What are the specifications of SN74HC574PWE4?
| YTEOL | 0 |
| Control Type | ENABLE LOW |
| Count Direction | UNIDIRECTIONAL |
| Family | HC/UH |
| JESD-30 Code | R-PDSO-G20 |
| JESD-609 Code | e4 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | BUS DRIVER |
| Max Frequency@Nom-Sup | 24000000Hz |
| Max I(ol) | 0.006A |
| Number of Bits | 8 |
| Number of Functions | 1 |
| Number of Ports | 2 |
| Output Characteristics | 3-STATE |
| Output Polarity | TRUE |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP20,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Packing Method | TUBE |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supply Current-Max (ICC) | 0.08mA |
| Prop. Delay@Nom-Sup | 0.066ns |
| Propagation Delay (tpd) | 330ns |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 6V |
| Supply Voltage-Min (Vsup) | 2V |
| Supply Voltage-Nom (Vsup) | 5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Trigger Type | POSITIVE EDGE |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| HTS Code | 8542.39.00.60 |
Where can I find the SN74HC574PWE4 datasheet?
SN74HC574PWE4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for SN74HC574PWE4?
Compatible alternatives and drop-in replacements for SN74HC574PWE4:
Frequently Asked Questions
What is the maximum operating frequency of the SN74HC574PWE4 and at what supply voltage is that specified?
The SN74HC574PWE4 is rated for a maximum clock frequency of 24 MHz at the nominal supply voltage, typically 5 V, with a 50 pF load capacitance on each output. This makes it suitable for bus register applications in embedded systems where the data bus clock does not exceed 24 MHz, such as parallel memory interfaces and I/O port latching in microcontroller designs operating in the low-to-mid speed range.
How do the 3-state outputs on the SN74HC574PWE4 enable multiple devices to share a single data bus?
The SN74HC574PWE4 features active-low output enable (OE) pins that place all 8 Q outputs into a high-impedance state when OE is driven high, effectively disconnecting the device from the bus. This allows several SN74HC574PWE4 registers to be connected to the same 8-bit data bus, with only one device enabled at a time, preventing bus contention. Bus arbitration logic drives each OE independently, a standard technique in memory-mapped I/O, address decoding, and backplane bus architectures used in PLCs and data acquisition systems.
Which PCB package does the SN74HC574PWE4 use, and how does its footprint compare to older DIP alternatives?
The SN74HC574PWE4 is housed in a 20-pin TSSOP (Thin Shrink Small Outline Package, PDSO-G20) with a 0.65 mm pin pitch and a body width of approximately 4.4 mm, which is significantly smaller than an equivalent 20-pin DIP package that measures about 25.4 mm in length. This compact SMD footprint saves board area in high-density PCB designs such as SBC backplanes, communication interface cards, and portable industrial terminals where board real estate is limited.
Can the SN74HC574PWE4 be used in a 3.3 V microcontroller design alongside 5 V peripherals?
The SN74HC574PWE4 supports a supply voltage range from 2 V to 6 V, so it can run at 3.3 V for direct integration with modern low-voltage microcontrollers. When interfacing with 5 V peripherals, the 3.3 V powered device's output levels may not fully meet the VIH threshold of standard 5 V TTL logic, so a level shifter or 5 V supply for the SN74HC574 itself may be required. At matching supply voltages of 3.3 V or 5 V, it provides rail-to-rail CMOS output levels and 6 mA drive strength.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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