SN74HC165PWRE4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
SN74HC165PWRE4 is a Texas Instruments integrated circuit for embedded, industrial, and mixed-signal electronic designs. It provides Small Outline Packages details for compact PCB layouts and purchasing checks. From RFQ pricing, it supports in-stock sourcing and.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 16
- Lifecycle
- OBSOLETE
- Datasheet
- SN74HC165PWRE4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 1 channel integrated circuit from Texas Instruments for production sourcing
- Small Outline Packages format supports footprint, assembly, and second-source checks
- Orderable MPN structure helps compare mounting, tolerance, package, or suffix variants
- RFQ workflow supports stock validation, lot traceability, and worldwide shipping review
Applications
SN74HC165PWRE4 is commonly selected for embedded, industrial, and mixed-signal electronic designs where a catalog configuration must match the approved bill of materials. Buyers use it for prototype builds, maintenance replenishment, and production sourcing when datasheet fit, lifecycle risk, and shipping timing need to be checked together.
Specifications
| YTEOL | 0 |
| Additional Feature | SISO OPERATION ALSO AVAILABLE |
| Count Direction | RIGHT |
| Family | HC/UH |
| JESD-30 Code | R-PDSO-G16 |
| JESD-609 Code | e4 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | PARALLEL IN SERIAL OUT |
| Max Frequency@Nom-Sup | 25000000Hz |
| Number of Bits | 8 |
| Number of Functions | 1 |
| Output Polarity | COMPLEMENTARY |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP16,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Packing Method | TR |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supply Current-Max (ICC) | 50mA |
| Propagation Delay (tpd) | 225ns |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 6V |
| Supply Voltage-Min (Vsup) | 2V |
| Supply Voltage-Nom (Vsup) | 5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Trigger Type | POSITIVE EDGE |
| fmax-Min | 29MHz |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| HTS Code | 8542.39.00.60 |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for SN74HC165PWRE4:
Parallel In Serial Out, HC/UH Series, 8-Bit, Right Direction, Complementary Output, CMOS, PDSO16
Frequently Asked Questions
Which design situations fit SN74HC165PWRE4 when 1 channel is required?
SN74HC165PWRE4 fits embedded, industrial, and mixed-signal electronic designs that need 1 channel, Small Outline Packages. Engineers should confirm the datasheet limits, footprint, and mating or surrounding components before releasing a production BOM.
How should purchasing compare SN74HC165PWRE4 with nearby Texas Instruments variants?
Compare SN74HC165PWRE4 by electrical rating, package option, lifecycle status, and ordering suffix. Keeping the same 1 channel configuration usually reduces redesign risk while alternates are checked for availability.
What assembly or sourcing details matter before quoting SN74HC165PWRE4?
Before quoting SN74HC165PWRE4, verify the Small Outline Packages format, approved manufacturer name, and required certificates. The 1 channel detail should align with incoming inspection, production scheduling, and worldwide shipping plans.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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