SN74CB3T16211ZQLR Texas Instruments Integrated Circuit (BGA) In Stock
Texas Instruments SN74CB3T16211ZQLR is a integrated circuit for embedded electronics, industrial controls, instrumentation, and production BOM sourcing. It offers 56 pins, -40°C to 85°C in BGA. From quote-based sourcing, buyers can request stock checks and worldwide shipping support.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 56
- Lifecycle
- OBSOLETE
- Datasheet
- SN74CB3T16211ZQLR Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SN74CB3T16211ZQLR?
- 56 pins, -40°C to 85°C documented for BOM matching and engineering review
- BGA format supports board-level integration and purchasing checks
- Texas Instruments SN74CB3T16211ZQLR ordering identity helps buyers match approved vendor lists
- Suitable for embedded electronics, industrial controls, instrumentation, and production BOM sourcing where repeatable component sourcing matters
What is SN74CB3T16211ZQLR used for?
SN74CB3T16211ZQLR is commonly used in embedded electronics, industrial controls, instrumentation, and production BOM sourcing, especially when buyers need a traceable Texas Instruments part for production or maintenance builds. It fits engineering teams that compare datasheet limits, package fit, lifecycle status, and sourcing availability before releasing a BOM.
What are the specifications of SN74CB3T16211ZQLR?
| YTEOL | 0 |
| Control Type | ENABLE LOW |
| Count Direction | BIDIRECTIONAL |
| Family | CB3T/3VT |
| JESD-30 Code | R-PBGA-B56 |
| JESD-609 Code | e1 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | BUS DRIVER |
| Number of Bits | 12 |
| Number of Functions | 2 |
| Number of Ports | 2 |
| Output Characteristics | 3-STATE |
| Output Polarity | TRUE |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA56,6X10,25 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Packing Method | TR |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supply Current-Max (ICC) | 0.07mA |
| Prop. Delay@Nom-Sup | 0.25ns |
| Propagation Delay (tpd) | 0.25ns |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 2.3V |
| Supply Voltage-Nom (Vsup) | 2.5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.65mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| HTS Code | 8542.39.00.60 |
Where can I find the SN74CB3T16211ZQLR datasheet?
SN74CB3T16211ZQLR Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for SN74CB3T16211ZQLR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which design requirement does SN74CB3T16211ZQLR usually cover?
SN74CB3T16211ZQLR is selected as a integrated circuit for embedded electronics, industrial controls, instrumentation, and production BOM sourcing. The available data lists 56 pins, giving engineers a concrete value to compare before approving the BOM line.
How should buyers check package fit for SN74CB3T16211ZQLR?
Buyers should compare the BGA listing, datasheet footprint, and assembly constraints. The current part record includes 56 pins, which helps confirm mechanical or electrical fit.
When is SN74CB3T16211ZQLR a practical sourcing candidate?
SN74CB3T16211ZQLR is practical when the BOM calls for a Texas Instruments component with 56 pins and the purchasing team needs stock checks, traceability, and worldwide shipping support.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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