SN65LVCP23PWG4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
Texas Instruments SN65LVCP23PWG4 is a 2x2 LVDS crosspoint switch supporting 2:1 multiplexing and 1:2 demultiplexing at up to 1.3 Gbps per channel. It provides 2 differential channels with separate outputs in a 16-pin TSSOP package for high-speed signal routing. Designed for SerDes, backplane, and video signal switching applications.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 16
- Lifecycle
- OBSOLETE
- Datasheet
- SN65LVCP23PWG4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SN65LVCP23PWG4?
- 2x2 LVDS crosspoint switch: 2:1 mux and 1:2 demux modes
- Signal rate up to 1.3 Gbps per differential channel
- 2 LVDS differential channels with separate outputs
- 16-pin TSSOP package with 0.65 mm pitch for compact SMT assembly
- Plastic/epoxy RoHS-compliant package construction
- Single-function crosspoint architecture for deterministic signal routing
What is SN65LVCP23PWG4 used for?
SN65LVCP23PWG4 is used in high-speed backplane signal routing, SerDes path switching, and LVDS video signal distribution in network equipment and industrial computing platforms. Its 2x2 crosspoint architecture at 1.3 Gbps makes it suitable for redundancy switching and flexible signal path selection in telecommunications and test equipment designs.
What are the specifications of SN65LVCP23PWG4?
| YTEOL | 0 |
| Analog IC - Other Type | CROSS POINT SWITCH |
| JESD-30 Code | R-PDSO-G16 |
| JESD-609 Code | e4 |
| Number of Channels | 2 |
| Number of Functions | 1 |
| Output | SEPARATE OUTPUT |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP16,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Current-Max (Isup) | 65mA |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Supply Voltage-Nom (Vsup) | 3.3V |
| Surface Mount | YES |
| Switch-off Time-Max | 2.5ns |
| Switch-on Time-Max | 2.5ns |
| Technology | BICMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| HTS Code | 8542.39.00.60 |
Where can I find the SN65LVCP23PWG4 datasheet?
SN65LVCP23PWG4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for SN65LVCP23PWG4?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
At what maximum data rate can SN65LVCP23PWG4 switch LVDS signals?
SN65LVCP23PWG4 supports LVDS signal switching at up to 1.3 Gbps per channel, making it suitable for high-speed backplane routing, SerDes path selection, and gigabit-rate differential signal distribution in network and industrial equipment.
How many channels does SN65LVCP23PWG4 provide, and what switching configurations are supported?
SN65LVCP23PWG4 provides 2 LVDS differential channels in a 2x2 crosspoint configuration, supporting both 2:1 multiplexing (combining 2 inputs to 1 output) and 1:2 demultiplexing (splitting 1 input to 2 outputs) for flexible signal routing at up to 1.3 Gbps.
Which packaging and assembly format does SN65LVCP23PWG4 use?
SN65LVCP23PWG4 comes in a 16-pin TSSOP package with 0.65 mm pitch and a rectangular plastic/epoxy body, suitable for standard surface-mount reflow soldering. The compact TSSOP footprint saves board space compared to larger SOIC packages in space-constrained PCB designs.
In a redundant backplane design, how can SN65LVCP23PWG4 improve system reliability?
SN65LVCP23PWG4 can switch a high-speed LVDS signal path between a primary and backup SerDes link at 1.3 Gbps, enabling automatic or manual redundancy switching without adding retiming or signal conditioning circuitry, which simplifies fault-tolerant backplane designs in telecommunications and industrial control systems.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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