SN55HVD233MDPSEP Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
SN55HVD233MDPSEP is a radiation-hardened CAN bus transceiver compliant with ISO 11898-2, housed in an 8-pin SOIC package and designed for space and aerospace applications. It features differential Schmitt trigger inputs, single 1-bit driver output, and high-reliability SEP (space-enhanced plastic) construction for operation in total ionizing dose environments. Used in satellite subsystems, launch vehicle avionics, and radiation-exposed industrial control networks.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 8
- Lifecycle
- ACTIVE
- Datasheet
- SN55HVD233MDPSEP Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SN55HVD233MDPSEP?
- Radiation-hardened design for total ionizing dose (TID) environments in space applications
- ISO 11898-2 compliant CAN bus transceiver supporting up to 1 Mbps data rate
- Differential Schmitt trigger receiver inputs for superior noise immunity
- SEP (Space-Enhanced Plastic) 8-pin SOIC package for high-reliability satellite assemblies
- Single-ended driver enabling standard CAN network wiring up to 40 m at 1 Mbps
- RoHS-compliant Pb-free construction with JESD-609 e4 rating
What is SN55HVD233MDPSEP used for?
The SN55HVD233MDPSEP is designed for CAN communication networks onboard satellites, spacecraft, and launch vehicles where ionizing radiation from the space environment could disrupt standard commercial transceivers. It also suits military and defense avionics systems that require radiation-tolerant serial communication at data rates up to 1 Mbps over differential CAN bus lines. Ground-based high-reliability systems in nuclear facilities or particle accelerator instrumentation that demand long-lifetime CAN bus operation under elevated radiation conditions also benefit from this SEP transceiver.
What are the specifications of SN55HVD233MDPSEP?
| Pbfree Code | Yes |
| Date Of Intro | 2018-12-13 |
| YTEOL | 15 |
| Differential Output | YES |
| Driver Number of Bits | 1 |
| High Level Input Current-Max | 0.00003A |
| Input Characteristics | DIFFERENTIAL SCHMITT TRIGGER |
| Interface IC Type | LINE TRANSCEIVER |
| Interface Standard | ISO 11898-2 |
| JESD-30 Code | R-PDSO-G8 |
| JESD-609 Code | e4 |
| Number of Channels | 1 |
| Number of Functions | 1 |
| Out Swing-Min | 1.2V |
| Output Low Current-Max | 0.05A |
| Output Polarity | TRUE |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Peak Reflow Temperature (Cel) | 260 |
| Receive Delay-Max | 105ns |
| Receiver Number of Bits | 1 |
| Supply Current-Max | 6mA |
| Supply Voltage-Max | 3.6V |
| Supply Voltage-Min | 3V |
| Supply Voltage-Nom | 3.3V |
| Supply Voltage1-Max | 3.6V |
| Supply Voltage1-Min | 3V |
| Supply Voltage1-Nom | 3.3V |
| Surface Mount | YES |
| Technology | BICMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Total Dose | 20k Rad(Si) V |
| Transmit Delay-Max | 1200ns |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.90 |
| Country of Origin | Mexico |
Where can I find the SN55HVD233MDPSEP datasheet?
SN55HVD233MDPSEP Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for SN55HVD233MDPSEP?
Compatible alternatives and drop-in replacements for SN55HVD233MDPSEP:
Frequently Asked Questions
What radiation tolerance level does SN55HVD233MDPSEP provide for space applications?
The SN55HVD233MDPSEP is designed as a radiation-hardened CAN transceiver using SEP (Space-Enhanced Plastic) construction to withstand significant total ionizing dose (TID) levels typical of low-Earth orbit and geostationary satellite missions. Its ISO 11898-2 compliant CAN bus interface operates at up to 1 Mbps, maintaining signal integrity through differential Schmitt trigger inputs even after radiation-induced threshold shifts that would degrade standard commercial-grade 8-pin SOIC transceivers.
At what maximum data rate does SN55HVD233MDPSEP operate on a CAN bus network?
Compliant with ISO 11898-2, the SN55HVD233MDPSEP supports CAN bus data rates up to 1 Mbps, allowing it to connect spacecraft or avionics subsystems with latencies well below 1 ms per frame on a terminated differential bus. At lower data rates such as 250 kbps or 500 kbps, the maximum bus length extends to 100 m or more, suitable for large vehicle wiring harnesses in satellite integration and test environments.
How does the SEP package of SN55HVD233MDPSEP differ from a standard commercial SOIC?
The SEP (Space-Enhanced Plastic) package of SN55HVD233MDPSEP uses the same 8-pin SOIC outline as a commercial transceiver but employs specially screened silicon, selected lead frame materials, and additional burn-in and test procedures to meet high-reliability requirements for space and military programs. Unlike a standard commercial 8-pin SOIC part, the SEP variant undergoes lot-level testing for radiation effects, temperature cycling down to -55°C, and long-term reliability screening at elevated temperatures, ensuring qualification for flight hardware.
Can SN55HVD233MDPSEP be used in non-space radiation environments such as nuclear instrumentation?
Yes, the SN55HVD233MDPSEP is suitable for any application where CAN bus communication must remain reliable under ionizing radiation, including nuclear power plant instrumentation, particle accelerator control networks, and industrial robot controllers near radiation sources. Its ISO 11898-2 interface operates at up to 1 Mbps with differential Schmitt trigger inputs, providing 30 µA maximum high-level input current and superior common-mode rejection for noisy environments typical of nuclear facility electrical infrastructure.
What is the pin count and package footprint of SN55HVD233MDPSEP for PCB layout planning?
The SN55HVD233MDPSEP is housed in an 8-pin SOIC (JESD-30 code R-PDSO-G8) with a standard 1.27 mm pitch, measuring approximately 5 mm × 4 mm body area. This compact footprint suits space-grade PCB assemblies where board area is limited, and the through-solder-joint mounting of SOIC-8 enables reliable mechanical bonds that survive the vibration and thermal cycling loads of launch and on-orbit operations.
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