SMS-144-01-SM-D SAMTEC Connector (Other) In Stock

What are the key features of SMS-144-01-SM-D?

• 88-position dual-row through-hole socket with 0.050" x 0.100" (1.27 mm x 2.54 mm) pitch supports high-density mixed-signal and digital board connections
• Through-hole mounting provides robust mechanical retention against vibration and repeated mating cycles compared to surface-mount alternatives
• Micro socket design accepts fine-pitch mating headers, enabling compact mezzanine module configurations where board separation is minimized

What is SMS-144-01-SM-D used for?

The SMS-144-01-SM-D is suited for mezzanine card, daughter board, and module-to-baseboard interconnect in embedded computing, test and measurement, and high-reliability industrial systems. Its 88-position, dual-row layout at 0.050-inch x 0.100-inch pitch accommodates a large number of signal and power contacts in a compact through-hole footprint. The through-hole construction provides mechanical strength for field-removable module applications where the mezzanine board may be inserted and removed multiple times during the product lifecycle.

Compliance & Regulatory

Where can I find the SMS-144-01-SM-D datasheet?

Official datasheet from SAMTEC

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