SMS-114-02-S-D SAMTEC Connector (Other) In Stock
SAMTEC SMS-114-02-S-D is a 28-position dual-row through-hole micro socket connector with 0.050" x 0.100" pitch and gold-over-nickel contact finish. It features a single-sided socket body measuring 0.7" long for reliable mating in compact board stacking applications. Ideal for test, measurement, and high-density PCB interconnect designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 28
- Lifecycle
- ACTIVE
- Datasheet
- SMS-114-02-S-D Datasheet PDF
- Category
- Connector
- Temp Range
- -65.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 28-position dual-row through-hole micro socket with 0.050 x 0.100 inch pitch for high-density layouts
- 30 microinch gold over 50 microinch nickel contact finish for reliable low-resistance mating
- Through-hole mounting providing robust mechanical retention on PCB assemblies
- Compact 0.7 inch body length enabling space-efficient board-to-board socket interconnects
Applications
The SMS-114-02-S-D is used in test and measurement equipment, instrumentation daughter cards, and development boards requiring a reliable 28-position micro socket interface. Its 0.050" x 0.100" pitch accommodates high pin density in compact interconnect designs, and the gold contact finish ensures low-resistance connections. The through-hole construction provides strong mechanical attachment for repeated mating cycles in lab and prototype environments.
Specifications
| Pbfree Code | Yes |
| YTEOL | 9.15 |
| Additional Feature | TIGER BUY CONTACT |
| Body Breadth | 0.22inch |
| Body Depth | 0.335inch |
| Body Length | 0.7inch |
| Body/Shell Style | SOCKET |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | FEMALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 10mΩ |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Dielectric Withstanding Voltage | 600VAC V |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insertion Force-Max | 2.224N |
| Insulation Resistance | 5000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | GLASS FILLED POLYESTER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.1inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 2.54mm |
| Plating Thickness | 30u inch |
| Rated Current (Signal) | 1A |
| Reference Standard | UL |
| Terminal Length | 0.19inch |
| Terminal Pitch | 1.27mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 28 |
| Withdrawl Force-Min | 1.668N |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and position count does the SMS-114-02-S-D support for board interconnect designs?
The SMS-114-02-S-D is a 28-position dual-row socket with a 0.050 inch by 0.100 inch pitch, providing high contact density for compact PCB interconnects. This pitch is common in micro-strip socket families for daughter card and module attachment. The gold-over-nickel contact finish ensures reliable mating across multiple insertion cycles in test and instrumentation applications.
How does the gold contact finish on the SMS-114-02-S-D improve connection reliability?
The SMS-114-02-S-D uses 30 microinches of gold plated over 50 microinches of nickel on mating contacts, providing excellent corrosion resistance and stable contact resistance across thousands of mating cycles. Gold contacts are preferred in test equipment sockets where repeated insertions are common, maintaining signal integrity at low contact resistance levels throughout the connector's service life.
What physical dimensions does the SMS-114-02-S-D body present on a PCB layout?
The SMS-114-02-S-D has a body length of 0.7 inch, breadth of 0.22 inch, and depth of 0.335 inch, fitting into tight PCB regions. The through-hole mounting pattern aligns to the standard 0.050 by 0.100 inch grid used in micro socket families. These dimensions allow the 28-position socket to fit in designs where standard 0.1 inch pitch connectors would consume too much board area.
In which application categories does the SMS-114-02-S-D provide the most value over surface-mount alternatives?
The SMS-114-02-S-D through-hole construction offers superior pull-out force compared to surface-mount sockets, making it preferable in test fixtures and development boards where connectors are mated and unmated frequently. The 28-position dual-row layout at 0.050 by 0.100 inch pitch provides 28 contacts in a 0.7 inch length, useful for prototype evaluation boards, FPGA daughter cards, and modular instrumentation platforms.
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