SMS-111-01-TM-D SAMTEC Connector (Other) In Stock
SAMTEC SMS-111-01-TM-D is a 22-position dual-row through-hole micro socket connector with a 0.050" x 0.100" pitch, providing reliable high-density interconnect for PCB mezzanine and daughter card applications. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 22
- Lifecycle
- ACTIVE
- Datasheet
- SMS-111-01-TM-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SMS-111-01-TM-D?
- 22-position dual-row through-hole micro socket at 0.050" x 0.100" (1.27 mm x 2.54 mm) pitch for high-density PCB-to-PCB interconnect
- Through-hole termination delivers superior mechanical pull-out strength compared to SMT alternatives, ideal for high-vibration environments
- Dual-row (D suffix) contact arrangement maximizes signal count in a minimal PCB footprint for space-constrained embedded designs
What is SMS-111-01-TM-D used for?
The SMS-111-01-TM-D is suited for high-density through-hole mezzanine interconnect in embedded computing modules, signal conditioning boards, and instrumentation daughter cards where 22 positions at 0.050" x 0.100" pitch provide compact, reliable signal routing. Its dual-row layout efficiently handles mixed signal and power connections in FPGA expansion boards and compact industrial controllers. The through-hole termination offers enhanced mechanical stability, making it appropriate for systems exposed to vibration or repeated plug-unplug cycles in the field.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SMS-111-01-TM-D datasheet?
SMS-111-01-TM-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SMS-111-01-TM-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pin configuration and pitch does the SMS-111-01-TM-D micro socket use?
The SMS-111-01-TM-D is a 22-position connector with a dual-row layout at 0.050" x 0.100" (1.27 mm x 2.54 mm) pitch, providing a compact high-density footprint used in mezzanine boards, FPGA daughter cards, and embedded signal processing modules.
For a ruggedized industrial design subject to 10g vibration, why is the SMS-111-01-TM-D through-hole socket preferred over a surface mount micro socket?
Through-hole termination on the SMS-111-01-TM-D creates solder joints that penetrate the PCB barrel, achieving mechanical hold strengths typically 3 to 5 times greater than comparable SMT pads, which prevents connector pull-out or solder joint cracking in systems exposed to vibration above 5g or thermal shock between -40°C and +85°C.
How does the dual-row design of the SMS-111-01-TM-D compare to a single-row micro socket of the same length?
A dual-row SMS-111-01-TM-D packs 22 positions in roughly the same board length as an 11-position single-row socket, doubling signal density per millimeter of connector length and allowing designers to route more differential pairs or mixed-voltage rails between stacked boards without increasing PCB area.
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About SAMTEC
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