SMS-109-02-SM-D SAMTEC Connector (Other) In Stock
SAMTEC SMS-109-02-SM-D is an 18-position dual-row through-hole micro socket connector with 0.050" x 0.100" pitch, designed for precision board-to-board and mezzanine interconnect. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 18
- Lifecycle
- ACTIVE
- Datasheet
- SMS-109-02-SM-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SMS-109-02-SM-D?
- 18-position dual-row micro socket with 0.050" x 0.100" (1.27 mm x 2.54 mm) pitch for high-density through-hole PCB mounting
- Dual-row (D suffix) layout maximizes pin count per unit length compared to single-row alternatives
- Through-hole termination provides superior mechanical retention strength for applications subjected to vibration or repeated mating cycles
What is SMS-109-02-SM-D used for?
The SMS-109-02-SM-D is ideal for high-density board-to-board mezzanine connections in compact embedded systems, instrumentation modules, and military-grade electronics where a 0.050" x 0.100" pitch through-hole socket provides reliable mechanical and electrical performance. Its 18-position dual-row layout suits FPGA daughter cards, memory modules, and signal conditioning boards that demand minimal PCB footprint. Through-hole mounting ensures robust interconnect integrity in environments with mechanical vibration or thermal cycling.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SMS-109-02-SM-D datasheet?
SMS-109-02-SM-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SMS-109-02-SM-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the contact pitch and pin configuration of the SMS-109-02-SM-D micro socket?
The SMS-109-02-SM-D uses a 0.050" x 0.100" (1.27 mm x 2.54 mm) pitch grid with 18 positions arranged in 2 rows, offering a high pin density in a compact through-hole footprint suitable for mezzanine and daughter-card interconnect applications.
When is a through-hole micro socket like the SMS-109-02-SM-D preferred over surface mount alternatives in rugged designs?
Through-hole mounting on the SMS-109-02-SM-D provides greater mechanical pull-out strength than SMT solder joints, making it preferable in designs subject to vibration above 5g or repeated mate-unmate cycles exceeding 50 insertions, such as field-replaceable modules in industrial or defense equipment.
Which applications benefit most from the dual-row 18-position layout of the SMS-109-02-SM-D?
The dual-row 18-position configuration efficiently routes 18 signals or power lines in a footprint under 12 mm long, making the SMS-109-02-SM-D well-suited for FPGA daughter cards, small signal conditioning boards, and compact instrumentation modules where both pin density and mechanical stability are critical.
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About SAMTEC
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