SMS-109-01-TM-D SAMTEC Connector (Other) In Stock
SAMTEC SMS-109-01-TM-D is an 18-position dual-row through-hole micro socket with a 0.050" x 0.100" pitch grid configuration. Gold-plated contacts deliver reliable signal integrity in compact module and test socket applications. Designed for repeated mating cycles in prototyping, instrumentation, and embedded systems.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 18
- Lifecycle
- ACTIVE
- Datasheet
- SMS-109-01-TM-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SMS-109-01-TM-D?
- 18-position dual-row layout on a 0.050" x 0.100" pitch grid enables dense through-hole interconnect in a minimal footprint
- Through-hole mounting provides robust mechanical retention suitable for applications subject to vibration or repeated mating
- Gold-plated micro socket contacts ensure low contact resistance and high reliability across extended mating cycles
What is SMS-109-01-TM-D used for?
The SMS-109-01-TM-D micro socket is ideal for socketing small dual-row pin arrays on prototype boards, test fixtures, and embedded modules where a 0.050" x 0.100" pitch interface is required. Its through-hole design provides strong mechanical stability, making it suitable for instrumentation and industrial control boards exposed to vibration. The 18-position layout efficiently accommodates multi-signal interfaces such as SPI, I2C, or UART buses alongside power and ground pins.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SMS-109-01-TM-D datasheet?
SMS-109-01-TM-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SMS-109-01-TM-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pin arrangement does the SMS-109-01-TM-D use, and which mating headers does it accept?
The SMS-109-01-TM-D is an 18-position dual-row micro socket on a 0.050" x 0.100" pitch grid, accepting 9 pins per row. It mates with compatible SAMTEC TSM or FTS series dual-row headers at the same pitch, enabling reliable socketed connections for modules and sub-assemblies requiring field removal or replacement.
For a test fixture design, how does the through-hole mounting of SMS-109-01-TM-D benefit repeated insertion of DUT modules?
Through-hole mounting anchors the SMS-109-01-TM-D to the PCB through all board layers, giving it far greater pull-out strength than SMT alternatives. This is critical in test fixtures where device-under-test modules may be inserted and removed hundreds of times; the 18 contacts retain their alignment and contact force across extended use without lifting pads.
How does the 0.050" x 0.100" mixed-pitch design of the SMS-109-01-TM-D differ from a standard 0.100" x 0.100" socket?
The 0.050" row spacing combined with 0.100" column spacing results in a rectangular grid that is narrower than a square 0.100" grid, reducing the connector's width by approximately 50% while maintaining standard column spacing. This asymmetric pitch is common in SAMTEC micro-socket families targeting compact dual-row module headers where board width is constrained to under 6 mm.
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About SAMTEC
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