SMS-108-02-SM-D SAMTEC Connector (Other) In Stock
SAMTEC SMS-108-02-SM-D is a 16-position dual-row through-hole micro socket with 0.050 inch by 0.100 inch pitch for high-density signal and power routing. Precision gold-plated contacts ensure reliable mating in compact embedded and test equipment boards. From $1.00 in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- SMS-108-02-SM-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SMS-108-02-SM-D?
- 16 positions in a dual-row through-hole layout on 0.050 x 0.100 inch pitch for ultra-high-density connections
- Precision micro socket contacts accept fine-pitch mating pins with controlled insertion force for repeatable engagement
- Gold-plated contacts maintain contact resistance below 50 milliohms across a minimum of 30 insertion cycles
- Through-hole mounting provides strong mechanical anchorage resisting vibration above 20 g and mechanical shock
- Dual-row configuration doubles pin count per unit length versus single-row alternatives at the same pitch
What is SMS-108-02-SM-D used for?
The SMS-108-02-SM-D is designed for high-density through-hole interconnect applications in embedded computing, FPGA carrier boards, and test and measurement instruments where 32 contacts must fit within a 0.050 x 0.100 inch pitch dual-row footprint. It is widely used in military electronics, communications line cards, and medical diagnostic boards requiring reliable, low-resistance signal paths with mechanical robustness from through-hole termination. The micro socket format enables maximum I/O density in compact multi-board stack-up assemblies.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SMS-108-02-SM-D datasheet?
SMS-108-02-SM-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SMS-108-02-SM-D?
Compatible alternatives and drop-in replacements for SMS-108-02-SM-D:
Board Connector, 16 Contact(s), 2 Row(s), Female, Straight, 0.05 inch Pitch, Solder Terminal, Black Insulator, Socket
Board Connector, 16 Contact(s), 2 Row(s), Female, Straight, 0.05 inch Pitch, Solder Terminal, Black Insulator, Socket
Board Connector, 16 Contact(s), 2 Row(s), Female, Straight, 0.05 inch Pitch, Solder Terminal, Black Insulator, Socket
Board Connector, 16 Contact(s), 2 Row(s), Female, Straight, 0.05 inch Pitch, Solder Terminal, Black Insulator, Socket
Frequently Asked Questions
What are the pitch dimensions and total contact count for the SMS-108-02-SM-D dual-row socket?
The SMS-108-02-SM-D provides 32 total contacts across 16 dual-row positions on a 0.050 inch row spacing and 0.100 inch column pitch, enabling very high contact density in a through-hole footprint that fits within half the board area of a standard 2.54 mm pitch single-row socket with the same pin count.
How does through-hole mounting in SMS-108-02-SM-D compare to SMT mounting for vibration-prone industrial applications?
Through-hole mounting of SMS-108-02-SM-D pins mechanically locks the connector into the PCB substrate, providing pull-out retention and vibration resistance superior to surface-mount solder joints, making it suitable for industrial equipment subjected to continuous vibration loads above 20 g per MIL-STD-810 test profiles or transportation shock environments.
Which SAMTEC mating pin header family is recommended for use with SMS-108-02-SM-D?
The SMS-108-02-SM-D mates with SAMTEC TSM series micro mating headers sharing the 0.050 x 0.100 inch pitch, providing a vendor-verified mating pair with controlled 30-cycle insertion life and contact resistance guaranteed below 50 milliohms throughout the connector's rated temperature range of -55°C to +125°C.
For a compact FPGA carrier board, what advantage does SMS-108-02-SM-D offer over a standard 2.54 mm pitch socket?
At 0.050 x 0.100 inch pitch, the SMS-108-02-SM-D fits 32 contacts in the board area a standard 2.54 mm pitch socket uses for only 16, effectively doubling usable I/O density per square centimeter of PCB real estate, which is a decisive advantage when routing dozens of FPGA user I/O lines or high-speed differential pairs in a space-limited carrier design.
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About SAMTEC
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