SMS-108-02-FM-D SAMTEC Connector (Other) In Stock
SAMTEC SMS-108-02-FM-D is a 16-position, dual-row through-hole micro socket strip with a 0.050 inch by 0.100 inch mixed pitch for high-density board-level interconnection. Designed for reliable mating with matching micro headers in embedded computing and instrumentation applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- SMS-108-02-FM-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SMS-108-02-FM-D?
- 16-position dual-row layout using a mixed 0.050" x 0.100" pitch enabling high-density signal routing in a compact footprint
- Through-hole termination providing superior mechanical strength and solder joint reliability for vibration-prone environments
- Female socket (FM) contact design accepting matching male pin headers with precise contact normal force
- Dual-row (D) configuration routing up to 16 signals in a shorter board length than equivalent single-row connectors
What is SMS-108-02-FM-D used for?
The SMS-108-02-FM-D is suited for board-stacking and module-to-baseboard connections in compact embedded computing, industrial I/O expansion, and scientific instrumentation designs. Its through-hole termination and dual-row layout handle the mechanical stress of repeated mating cycles, making it reliable in field-swappable module applications. The mixed 0.050 by 0.100 inch pitch supports legacy and modern high-density PCB footprints simultaneously.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SMS-108-02-FM-D datasheet?
SMS-108-02-FM-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SMS-108-02-FM-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which footprint and mating details distinguish SMS-108-02-FM-D in a board design?
SAMTEC SMS-108-02-FM-D is a 16-position, dual-row through-hole micro socket strip with a 0.050 inch by 0.100 inch mixed pitch for high-density board-level interconnection. Designed for reliable mating with matching micro headers in embedded computing and instrumentation applications. At 25 °C, verify its stated position count, pitch, mounting orientation, and mating-height constraints against the current manufacturer drawing before PCB release.
How should receiving teams authenticate and inspect SMS-108-02-FM-D?
Inspect SMS-108-02-FM-D contacts and housings at 25 °C, confirming the complete ordering suffix, documented position count, termination option, and packaging condition before accepting the production lot.
Where should engineers validate SMS-108-02-FM-D before volume assembly?
Use SMS-108-02-FM-D first in a controlled 25 °C prototype build, then check footprint alignment, mating retention, contact continuity, and assembly clearance under expected mechanical loading.
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