SMS-107-02-SM-D SAMTEC Connector (Other) In Stock
SAMTEC SMS-107-02-SM-D is a 14-position dual-row through-hole micro socket with 0.050 inch x 0.100 inch pitch, designed for high-density micro pin-header mating in compact PCB applications. The dual-row layout delivers 28 contact points in a minimal board footprint. Available from stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 14
- Lifecycle
- ACTIVE
- Datasheet
- SMS-107-02-SM-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 0.050 inch x 0.100 inch micro pitch dual-row layout providing 28 contacts in a footprint smaller than standard 2.54 mm connectors
- Through-hole construction delivering superior mechanical retention strength for connectors subject to repeated mating cycles or vibration environments
- Dual-row (D suffix) configuration enabling mixed signal, power, and ground assignment across 14 positions per row for compact module interfaces
Applications
The SMS-107-02-SM-D is suited for high-density daughter-card, module, and mezzanine board interconnections in embedded computing, test-and-measurement equipment, and aerospace electronics where space is at a premium. The 0.050 x 0.100 inch micro pitch reduces connector footprint by approximately 50% compared to standard 2.54 mm pitch sockets, enabling denser PCB layouts without sacrificing pin count. Its through-hole mounting provides mechanical robustness for applications subject to vibration, shock, or repeated plug-in cycles.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pin pitch of the SMS-107-02-SM-D and how does it compare to standard 2.54 mm pitch sockets?
The SMS-107-02-SM-D uses a 0.050 inch x 0.100 inch (1.27 mm x 2.54 mm) micro pitch, which halves the row spacing of standard 2.54 mm square-pitch connectors. This allows the 14-position dual-row socket to occupy approximately 50% less PCB area than an equivalent standard-pitch connector, enabling denser board layouts in miniaturized modules, handheld instruments, and high-density SBC expansion interfaces.
Why is through-hole mounting preferred for the SMS-107-02-SM-D in applications with mechanical stress or repeated mating?
Through-hole mounting of the SMS-107-02-SM-D anchors all 28 contact pins directly through the PCB, creating mechanical bonds that withstand mating forces exceeding 5 N per pin and vibration levels up to 15 G without solder joint fatigue. This makes the connector suitable for industrial handheld devices, laboratory instruments with removable modules, and airborne electronics where surface-mount connectors would risk pad delamination under repeated plug-in cycles or shock loading.
Which compact module interface designs are best matched to the SMS-107-02-SM-D dual-row micro socket?
The SMS-107-02-SM-D is ideal for mating with SAMTEC TSM or SMH series micro headers in SOM (system-on-module) carrier boards, FPGA mezzanine cards, and RF front-end daughterboards requiring 28 signals in a connector under 20 mm in length. The 0.050 x 0.100 inch pitch accommodates mixed digital, analog, and low-voltage power pins at current ratings up to 1 A per contact in a through-hole footprint compatible with 1.6 mm standard PCB thickness.
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