SMS-105-02-SM-D SAMTEC Connector (Other) In Stock
SAMTEC SMS-105-02-SM-D is a 10-position dual-row through-hole micro socket with 0.050-inch by 0.100-inch pitch, designed for reliable mating with standard micro pin headers. It provides secure through-hole mounting suitable for applications requiring strong mechanical retention and consistent contact integrity. Available through global distributors with prompt delivery.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 10
- Lifecycle
- ACTIVE
- Datasheet
- SMS-105-02-SM-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 10-position dual-row configuration at 0.050" x 0.100" pitch offers a compact footprint for high-density through-hole interconnects between boards and modules
- Through-hole mounting provides superior pull-out force and mechanical retention compared to SMT alternatives, ideal for connectors subject to repeated mating and unmating
- Micro socket design accommodates standard micro pin headers with precise contact geometry ensuring consistent low-contact-resistance mating across the full lifecycle
Applications
The SMS-105-02-SM-D is used in modular embedded systems, FPGA daughter cards, and test-and-measurement equipment where a 10-pin dual-row through-hole micro socket provides reliable board-to-board or module-to-baseboard connectivity. Its 0.050-by-0.100-inch pitch hybrid grid suits legacy board designs that mix standard and micro pitch signals on the same connector. The through-hole retention is especially valuable in field-serviceable equipment where modules are swapped frequently.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pitch configuration of SMS-105-02-SM-D and how does it differ from a standard 0.100-inch pitch socket?
The SMS-105-02-SM-D uses a dual pitch of 0.050 inches between contacts in one direction and 0.100 inches in the other, yielding 10 total positions in a dual-row arrangement. This mixed 0.050 x 0.100-inch pitch grid enables higher contact density than a purely 0.100-inch pitch socket while remaining compatible with mating headers designed for the same hybrid grid, allowing more signals to occupy a smaller PCB area than single-pitch alternatives.
Why would a designer choose through-hole mounting for SMS-105-02-SM-D over a surface-mount equivalent?
Through-hole mounting provides mechanical anchoring through the PCB with solder joints on both pads and barrel walls, delivering pull-out forces exceeding 10 N compared to typical SMT solder joint strengths in similar-sized connectors. This is critical in field-service applications where a mating module or cable is inserted and removed dozens of times per year, or in environments with mechanical shock loads above 5 G that could dislodge SMT-only solder joints.
Which embedded computing or test applications are best matched to the 10-position SMS-105-02-SM-D socket?
The SMS-105-02-SM-D is well matched to FPGA mezzanine card sockets, microcontroller debug expansion ports, and benchtop test fixture daughterboard sockets where a 10-pin interface carries SPI, I2C, UART, or JTAG signals at logic levels of 1.8 V to 5 V. The compact dual-row format also fits embedded module applications such as industrial sensor nodes and data-acquisition boards that require a small-footprint through-hole connector with long service life.
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