SMS-102-02-F-D SAMTEC Connector (Other) In Stock
The SAMTEC SMS-102-02-F-D is a 4-position dual-row through-hole micro socket connector with 0.050 inch by 0.100 inch staggered pitch. It accepts micro-size mating pins and provides reliable low-profile vertical interconnects for tight PCB layouts. Available from stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 4
- Lifecycle
- ACTIVE
- Datasheet
- SMS-102-02-F-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SMS-102-02-F-D?
- Dual-row 4-position through-hole micro socket with 0.050 x 0.100 inch staggered pitch for ultra-compact PCB interconnects
- Through-hole termination with -F contact style providing robust mechanical retention and consistent electrical contact across mating cycles
- Micro socket design compatible with fine-pitch mating headers enabling high-density signal interconnects in space-constrained embedded modules
What is SMS-102-02-F-D used for?
The SMS-102-02-F-D is suited for compact board-to-board and board-to-cable micro interconnects in handheld instruments, wearable devices, and miniaturized embedded modules where PCB real estate is at a premium. Its 4-position dual-row layout at 0.050 x 0.100 inch pitch allows dense signal routing in a footprint smaller than standard 0.100 inch pitch connectors. The through-hole construction provides superior pull-out strength compared to SMT alternatives, making it appropriate for applications subject to mechanical stress or repeated mating.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SMS-102-02-F-D datasheet?
SMS-102-02-F-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SMS-102-02-F-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pin layout and pitch configuration of the SMS-102-02-F-D micro socket?
The SMS-102-02-F-D features 4 positions arranged in a dual-row configuration with a staggered 0.050 inch by 0.100 inch pitch. This non-uniform pitch creates an ultra-compact footprint smaller than standard 2x2 connectors at 0.100 inch pitch, allowing high-density interconnects in miniaturized PCB designs where as little as 2 mm spacing between adjacent connectors is required.
Why choose through-hole mounting for the SMS-102-02-F-D in mechanically stressed applications?
Through-hole mounting pins of the SMS-102-02-F-D are soldered through the PCB, creating a mechanical bond that withstands repeated mating cycles and axial pull forces typically exceeding 10 N per contact, far greater than SMT solder joint strength. This is essential in handheld instruments, test probes, and field-replaceable module sockets where the connector is mated and unmated frequently under manual force, preventing pad lift or solder fatigue that would affect SMT alternatives.
In which miniaturized embedded applications does the SMS-102-02-F-D offer a space advantage over standard 0.100 inch pitch sockets?
The SMS-102-02-F-D's staggered 0.050 x 0.100 inch dual-row pitch reduces the connector body length compared to a 4-position single-row socket at 0.100 inch pitch by approximately 50%, freeing board area in wearable sensors, hearing aids, and compact IoT modules operating from 1.8 V to 3.3 V supplies. Its micro socket profile also lowers mated height, supporting assemblies where total stack height must remain below 5 mm.
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About SAMTEC
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