SMS-101-02-F-D SAMTEC Connector (Other) In Stock
SAMTEC SMS-101-02-F-D is a 2-position, dual-row, through-hole micro socket with 0.050 x 0.100 inch pitch, designed for removable mating with 0.050 inch pitch micro headers. Its low-profile form factor and gold-plated contacts deliver reliable signal continuity in compact PCB designs. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 2
- Lifecycle
- ACTIVE
- Datasheet
- SMS-101-02-F-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SMS-101-02-F-D?
- 2-position dual-row through-hole micro socket with 0.050" x 0.100" pitch for precise mating with standard micro header pins
- Through-hole mounting provides robust solder retention, withstanding vibration and repeated mating without contact fatigue
- Compact micro socket profile enables module interchangeability in small-form-factor PCB designs requiring minimal footprint
What is SMS-101-02-F-D used for?
The SMS-101-02-F-D is used as a removable socket interface in compact embedded systems, test fixture interconnects, and small module boards requiring a 2-position, through-hole micro connector at 0.050 x 0.100 inch pitch. Its small size suits designs where only 2 signal pins are needed for power or signal connections to a plug-in daughter card or sensor module.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SMS-101-02-F-D datasheet?
SMS-101-02-F-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SMS-101-02-F-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch configuration does the SMS-101-02-F-D micro socket use for header mating?
The SMS-101-02-F-D uses a 0.050 inch by 0.100 inch mixed-pitch configuration across its 2 positions in a dual-row layout. This pitch combination allows direct mating with standard 0.050 inch micro headers while maintaining a 0.100 inch row-to-row spacing, providing adequate mechanical clearance for reliable contact engagement and disengagement.
In which low-pin-count embedded or sensor applications is SMS-101-02-F-D most appropriate?
The SMS-101-02-F-D is well-suited for 2-signal interfaces in low-pin-count embedded boards such as I2C sensor modules, UART debug connectors, and simple power distribution sockets. Its 2-position through-hole design handles signal currents up to approximately 1 A per pin at 0.050 inch pitch, making it practical for small module attachment where only 2 connections are needed.
How does the through-hole mounting style of SMS-101-02-F-D improve mechanical stability compared to SMT micro sockets?
Through-hole mounting on the SMS-101-02-F-D creates solder fillets that extend through the PCB, providing solder joints that resist pull-out forces and lateral stress far better than SMT pads. For 2-position sockets subject to frequent plug-and-play cycles or environments with mechanical shock, through-hole retention can withstand axial forces of over 5 N per pin before solder joint failure, compared to lower forces typical of SMT alternatives.
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About SAMTEC
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