SMS-101-01-SM-D SAMTEC Connector (Other) In Stock
SAMTEC SMS-101-01-SM-D is a 2-position through-hole micro socket with 0.050 by 0.100 inch pitch, dual-row configuration, designed for reliable low-profile board-to-board mating in space-constrained PCB applications requiring fine-pitch interconnect.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 2
- Lifecycle
- ACTIVE
- Datasheet
- SMS-101-01-SM-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SMS-101-01-SM-D?
- 2-position dual-row through-hole micro socket with 0.050 x 0.100 inch pitch for reliable fine-pitch board-to-board connections in compact PCB designs
- Through-hole mounting provides superior mechanical retention compared to surface mount alternatives, withstanding pull forces encountered in removable module applications
- Micro socket design accepts matching micro pin connectors for low-profile mating with minimal PCB real estate consumption in dense electronic assemblies
What is SMS-101-01-SM-D used for?
The SMS-101-01-SM-D is used in compact electronic modules, daughtercard interconnect systems, and prototyping boards where a 2-position dual-row micro socket at 0.050 by 0.100 inch pitch provides secure removable connections. Its through-hole construction makes it suitable for applications requiring robust mechanical attachment and repeated mating cycles in test fixtures and field-replaceable modules. The fine-pitch configuration allows placement in areas where standard 0.100 inch connectors would exceed available board space.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SMS-101-01-SM-D datasheet?
SMS-101-01-SM-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SMS-101-01-SM-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch dimensions does the SMS-101-01-SM-D micro socket use and how do they affect PCB footprint design?
The SMS-101-01-SM-D uses a 0.050 inch by 0.100 inch pitch, meaning contacts are spaced 0.050 inch in one axis and 0.100 inch in the other. This asymmetric pitch results in a rectangular dual-row footprint that fits within tight PCB areas where a standard 0.100 x 0.100 inch grid connector would not be accommodated.
How does through-hole mounting benefit the SMS-101-01-SM-D in removable module applications?
Through-hole mounting anchors the SMS-101-01-SM-D into the PCB via solder joints through the board laminate, providing mechanical retention forces typically exceeding several Newtons of pull strength. This is critical in applications where a daughtercard or module is inserted and removed repeatedly, as through-hole joints resist the 2-position socket being lifted off the board under mating loads.
What mating connector family is compatible with the SMS-101-01-SM-D for dual-row 0.050 x 0.100 inch pitch systems?
The SMS-101-01-SM-D is designed to mate with SAMTEC's corresponding micro pin header series using the same 0.050 x 0.100 inch pitch. The 2-position dual-row socket accepts male pins with a matching contact tip size, maintaining contact resistance below 20 milliohms per contact across the 2 positions in board-stacking or module interconnect configurations.
When should a designer choose SMS-101-01-SM-D over a surface mount micro socket for the same 2-position application?
A designer should choose the through-hole SMS-101-01-SM-D when the PCB assembly will experience mechanical stress, vibration, or repeated plug-in events that would lift surface mount solder joints. Through-hole anchoring in the 0.050 x 0.100 inch pitch format tolerates higher lateral forces than SMT pads, making it the preferred choice for industrial, test fixture, and ruggedized portable electronic applications with 2-position dual-row requirements.
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About SAMTEC
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