SFM-149-T2-SM-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-149-T2-SM-D-A-K is a 98-position dual-row high-reliability socket strip with 0.050" (1.27 mm) pitch in a surface mount package. Delivers 49 pins per row with gold-plated contacts for precise, repeatable mating in high-density mezzanine and daughtercard PCB interconnect applications. Available from stock worldwide with competitive pricing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 98
- Lifecycle
- ACTIVE
- Datasheet
- SFM-149-T2-SM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-149-T2-SM-D-A-K?
- 98-position dual-row 0.050" (1.27 mm) pitch surface mount socket strip providing 49 pins per row for extremely high-density signal routing in compact PCB form factors
- High-reliability gold-plated contact system delivering low contact resistance and consistent performance across hundreds of mating cycles in modular and field-replaceable board designs
- Surface mount package with tight 1.27 mm pitch compatible with automated pick-and-place assembly and lead-free reflow soldering at up to 260°C peak temperature
What is SFM-149-T2-SM-D-A-K used for?
The SFM-149-T2-SM-D-A-K is designed for high-channel-count mezzanine card stacking, FPGA expansion modules, and high-density daughtercard interconnection in computing, telecommunications, and defense electronics platforms. Its 98-position dual-row 0.050" pitch layout supports parallel bus interfaces, mixed-signal routing, and large-scale I/O expansion in server blades, software-defined radio modules, and advanced test and measurement instruments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-149-T2-SM-D-A-K datasheet?
SFM-149-T2-SM-D-A-K Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-149-T2-SM-D-A-K?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the total position count and row arrangement of the SFM-149-T2-SM-D-A-K, and what pitch does it use?
The SFM-149-T2-SM-D-A-K provides 98 positions arranged in a dual-row configuration with 49 pins per row at a 0.050" (1.27 mm) pitch. This high-density pitch packs twice the signal count of standard 0.100" connectors in the same board length, making it highly efficient for FPGA I/O expansion, high-speed parallel bus routing, and mezzanine card interfaces where board space is limited.
How does the 0.050" pitch of the SFM-149-T2-SM-D-A-K compare to standard 0.100" connectors for PCB routing density?
The 0.050" (1.27 mm) pitch of the SFM-149-T2-SM-D-A-K provides double the pin density of standard 0.100" (2.54 mm) pitch connectors, allowing 98 circuits in approximately the same PCB length as a 49-position 0.100" connector. This enables a 2× increase in signal routing density, which is critical for FPGA expansion boards, high-speed data acquisition modules, and mezzanine interfaces requiring more than 64 signals in a compact interconnect footprint.
For a defense electronics mezzanine application, what mating connector family is compatible with the SFM-149-T2-SM-D-A-K?
The SFM-149-T2-SM-D-A-K is designed to mate with SAMTEC's corresponding TSM or SHF series 0.050" pitch header strips in a 98-position dual-row configuration. The gold-plated contact system achieves contact resistance below 20 milliohms and supports insertion forces well within acceptable limits for field-replaceable modules used in defense electronics, where connector durability across 100+ mating cycles is a standard reliability requirement.
What reflow soldering specifications apply to the SFM-149-T2-SM-D-A-K during PCB assembly?
The SFM-149-T2-SM-D-A-K is designed for surface mount reflow soldering with a peak temperature tolerance of up to 260°C, compatible with standard lead-free solder profiles (SAC305 alloy). Its 0.050" (1.27 mm) pitch SMT pads require a precision stencil with approximately 0.5 mm apertures and a stencil thickness of 0.12–0.15 mm to achieve proper solder paste volume for reliable joint formation on all 98 positions during automated assembly.
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About SAMTEC
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