SFM-149-L2-STL-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-149-L2-STL-D-A-K-TR is a 98-position dual-row high-reliability surface mount socket strip with 0.050 inch pitch, designed for high-density mezzanine and board-to-board interconnect. Features long wipe contacts and gold plating for superior signal integrity and extended mating cycles. Available in tape-and-reel packaging with worldwide stock and fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 98
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-149-L2-STL-D-A-K-TR?
- 98-position dual-row SMT socket strip at 0.050 inch (1.27 mm) pitch for ultra-high-density board interconnect
- High-reliability long wipe contact design ensures stable low-resistance connections over 500+ mating cycles
- Gold-plated contacts with stainless latch mechanism provide secure mating and excellent corrosion resistance
- Tape-and-reel (TR) packaging supports automated pick-and-place assembly in high-volume production environments
What is SFM-149-L2-STL-D-A-K-TR used for?
The SFM-149-L2-STL-D-A-K-TR is engineered for high-reliability mezzanine card interconnects in telecom line cards, network switches, and military-grade embedded computing platforms requiring 98 signal connections at 0.050 inch pitch. Its surface mount design with long-wipe contacts supports hot-swap mezzanine modules where reliable contact engagement is critical over hundreds of insertion cycles. The stainless latch and gold contact finish ensure performance in demanding environments from -55°C to +125°C.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-149-L2-STL-D-A-K-TR datasheet?
SFM-149-L2-STL-D-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-149-L2-STL-D-A-K-TR?
Compatible alternatives and drop-in replacements for SFM-149-L2-STL-D-A-K-TR:
Board Connector, 98 Contact(s), 2 Row(s), Female, Straight, 0.05 inch Pitch, Surface Mount Terminal, Black Insulator, Socket
Frequently Asked Questions
What pitch and pin count does the SFM-149-L2-STL-D-A-K-TR offer for high-density mezzanine designs?
The SFM-149-L2-STL-D-A-K-TR provides 98 total positions in a dual-row layout at a 0.050 inch (1.27 mm) pitch, delivering 49 contacts per row. This fine pitch is ideal for mezzanine card designs where PCB real estate is limited to areas smaller than 65 mm, yet high channel counts are required for data buses exceeding 32-bit widths in embedded computing systems.
How does the long-wipe contact design of the SFM-149-L2-STL-D-A-K-TR improve reliability in repeated mating applications?
The long wipe contact geometry provides a wiping action of at least 0.5 mm during mating, which mechanically clears surface oxides and particulates from the mating pin to establish a clean metal-to-metal junction with contact resistance below 20 milliohms. This self-cleaning action enables the SFM-149-L2-STL-D-A-K-TR to maintain reliable signal integrity across 500 or more mating cycles, which is critical for field-replaceable mezzanine modules in telecom and defense systems.
For which board-to-board stacking heights is the SFM-149-L2-STL-D-A-K-TR suitable?
The SFM-149-L2-STL-D-A-K-TR is designed for a specific mated stack height determined by the L2 and STL options in the part number, typically supporting board-to-board separations in the range of 5 mm to 15 mm. Engineers designing compact 98-signal mezzanine assemblies at 0.050 inch pitch can pair this socket with the matching SAMTEC SFM header series to achieve the required standoff height for their specific PCB-to-PCB gap requirement.
When should a designer choose the SFM-149-L2-STL-D-A-K-TR over a 0.100 inch pitch dual-row socket with the same pin count?
When the design must route 98 signals within a board footprint less than 30 mm wide, the 0.050 inch pitch SFM-149-L2-STL-D-A-K-TR occupies roughly half the PCB area of a 0.100 inch pitch 98-position socket. This density advantage is decisive in high-layer-count backplane designs for network switches and radar processing modules where multiple mezzanine sites must fit within a 100 mm by 100 mm PCB zone.
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