SFM-149-L2-SM-D-A SAMTEC Connector (Other) In Stock
SAMTEC SFM-149-L2-SM-D-A is a 98-position dual-row high-reliability socket strip with 0.050" pitch for surface mount board-to-board interconnection. Provides gold-plated contacts and low-profile SMT attachment for high-density signal routing in compact electronic assemblies. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 98
- Lifecycle
- ACTIVE
- Datasheet
- SFM-149-L2-SM-D-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 98-position dual-row layout at 0.050" (1.27mm) pitch providing up to 196 contacts in a low-profile surface mount footprint
- High-reliability gold-plated contacts ensuring consistent electrical performance across thousands of mating cycles in demanding environments
- L2 lead length option offering precise standoff height control for controlled-impedance signal routing on high-speed PCB assemblies
Applications
The SFM-149-L2-SM-D-A is well suited for high-speed mezzanine card interconnects, FPGA daughter boards, and backplane-to-module interfaces where 98 dual-row positions must be routed reliably at 0.050" pitch. Its surface mount configuration with L2 lead length supports controlled-impedance PCB designs used in telecommunications, server computing, and test instrument daughtercard assemblies. Engineers choose this socket strip when board-to-board interconnection density exceeds what standard 0.100" pitch solutions provide.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many total contact positions does the SFM-149-L2-SM-D-A support at 0.050" pitch?
The SFM-149-L2-SM-D-A provides 98 positions in a dual-row configuration at 0.050" (1.27 mm) pitch, delivering up to 196 individual contact points for routing high-density signal buses on surface mount mezzanine and daughter card assemblies.
For which high-speed PCB designs does the L2 lead length variant of the SFM-149 series offer an advantage?
The L2 lead length variant provides a specific standoff height that controls the air gap between mating boards, which helps manage differential impedance and crosstalk on high-speed signals above 1 Gbps in FPGA mezzanine cards, backplane modules, and server computing interconnects operating at 0.050" pitch.
When is SFM-149-L2-SM-D-A a better alternative to a 0.100" pitch connector for backplane designs?
When a design requires more than 100 signal lines in a constrained board area, the SFM-149-L2-SM-D-A at 0.050" pitch routes up to 196 contacts in roughly half the length compared to a 0.100" pitch alternative, reducing PCB real estate while maintaining the high-reliability SMT attachment needed for backplane and server blade applications.
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