SFM-149-L2-LM-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-149-L2-LM-D-A-P is a 98-position, dual-row, high-reliability surface-mount socket strip on 0.050 inch pitch with L2 standoff, low-profile male termination, anti-solder-wicking contacts, and polarized housing. It delivers high-density 49-contacts-per-row board-to-board connectivity at a controlled mating height. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 98
- Lifecycle
- ACTIVE
- Datasheet
- SFM-149-L2-LM-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-149-L2-LM-D-A-P?
- 98-position dual-row socket on 0.050 inch (1.27 mm) pitch providing 49 contacts per row for maximum signal density in a single connector footprint
- L2 standoff controls the board-to-board mating height to approximately 4.0 mm, ensuring mechanical consistency across stacked PCB assemblies
- Anti-solder-wicking (A) contact design blocks flux migration into the mating zone during lead-free reflow at up to 260 °C
- Polarized (P) housing enforces correct mating orientation on a 98-pin array, preventing catastrophic reverse-insertion damage to high-density signal buses
What is SFM-149-L2-LM-D-A-P used for?
The SFM-149-L2-LM-D-A-P is designed for high-pin-count mezzanine and daughter card applications in telecommunications, high-performance computing, and large FPGA module interfaces where up to 98 signals must traverse a single fine-pitch connector with controlled stack height. Its L2 standoff combined with 0.050 inch pitch makes it a preferred choice for radar processing boards, data acquisition modules, and GPU expansion cards where both pin density and inter-board clearance are design constraints. The anti-solder-wicking and polarized features reduce assembly defect rates in volume SMT production of complex multilayer PCBs.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-149-L2-LM-D-A-P datasheet?
SFM-149-L2-LM-D-A-P Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-149-L2-LM-D-A-P?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal or power lines can SFM-149-L2-LM-D-A-P carry, and what is its physical row length?
The SFM-149-L2-LM-D-A-P carries 98 total positions with 49 contacts per row on a 0.050 inch (1.27 mm) pitch, resulting in a row length of approximately 2.45 inches (62.2 mm) per mated pair. Designers can route 98 independent signal lines, differential pairs at data rates up to several Gbps, or mixed signal-and-power configurations through a single connector site, making it one of the highest-density single-body 0.050 inch pitch socket options in the SAMTEC SFM series.
When would an engineer choose SFM-149-L2-LM-D-A-P over multiple smaller connectors to interface a large FPGA module?
Using a single 98-position SFM-149-L2-LM-D-A-P instead of multiple 44- or 50-pin connectors eliminates the mechanical height variation between connectors that can bow a 1.6 mm thick daughter PCB over a 60 mm span. A single-body socket maintains parallelism within 0.1 mm across the 2.45 inch mating length, which is critical for FPGA modules with BGA packages where differential co-planarity above 0.2 mm causes solder joint opens. It also reduces bill-of-materials SKU count and simplifies the footprint placement in the PCB layout tool.
How does the low-profile male (LM) termination style of SFM-149-L2-LM-D-A-P affect PCB assembly and solder joint reliability?
The LM (low-profile male) termination uses a shortened SMT tail that reduces the solder volume required per contact to approximately 0.3 mm standoff height, lowering the mechanical lever arm on each joint compared to a standard-length tail. During thermal cycling between -40 °C and +85 °C in industrial applications, the shorter tail minimizes shear stress on the solder fillet for each of the 98 contact pads, extending solder joint fatigue life by an estimated 20 to 30 percent versus standard-tail alternatives, based on IPC-9701 thermal cycle test models for 0.050 inch pitch SMT connectors.
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