SFM-149-02-S-D-A-P-TR SAMTEC Connector (Other) In Stock
SFM-149-02-S-D-A-P-TR is a 98-position dual-row high-reliability socket strip from SAMTEC on a 1.27 mm (0.050 inch) pitch in surface-mount format. It offers gold-plated contacts, tape-and-reel delivery, and is designed for space-constrained high-density mezzanine board interconnect.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 98
- Lifecycle
- ACTIVE
- Datasheet
- SFM-149-02-S-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-149-02-S-D-A-P-TR?
- 98-position dual-row layout on 1.27 mm pitch achieving twice the pin density of 2.54 mm connectors in the same PCB footprint
- High-reliability socket design rated for 100+ mating cycles with gold-plated contacts maintaining contact resistance below 30 mΩ
- Surface-mount termination compatible with lead-free reflow soldering up to 260°C for single-pass PCB assembly
- Tape-and-reel packaging enabling fully automated SMT pick-and-place at high production volumes
- Dual-row configuration routing 98 signals across a compact edge while preserving routing lanes on inner PCB layers
What is SFM-149-02-S-D-A-P-TR used for?
The SFM-149-02-S-D-A-P-TR is used in high-density mezzanine interconnect applications such as FMC daughter cards, FPGA carrier boards, and compact embedded computing modules where 98 signals must cross a board-to-board interface at 1.27 mm pitch. Its high-reliability socket design supports removable module configurations in test and measurement instruments and military or aerospace avionics that require repeated card insertions. The tape-and-reel format makes it well suited for volume PCB assembly in telecommunications and industrial automation equipment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-149-02-S-D-A-P-TR datasheet?
SFM-149-02-S-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-149-02-S-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How much denser is the SFM-149-02-S-D-A-P-TR compared to a standard 2.54 mm pitch strip for the same 98-pin count?
At 1.27 mm pitch, the SFM-149-02-S-D-A-P-TR occupies roughly half the PCB edge length of an equivalent 2.54 mm pitch connector for 98 positions. Each row of 49 contacts spans approximately 62 mm at 1.27 mm pitch compared to 124 mm at 2.54 mm pitch, enabling the same signal count to fit on boards with strict dimensional constraints such as half-length PCIe add-in cards or mezzanine modules.
What mating cycle life does the SFM-149-02-S-D-A-P-TR support and what contact plating enables this?
The SFM-149-02-S-D-A-P-TR is rated as a high-reliability socket with gold-plated contacts supporting a minimum of 100 mating cycles while maintaining contact resistance below 30 mΩ. Gold plating resists oxidation and fretting corrosion during repeated insertions, making this socket appropriate for removable daughter cards, field-replaceable modules, and test fixtures that undergo regular swapping over a product service life of 5 to 10 years.
Which high-density board-to-board applications commonly use the SFM-149-02-S-D-A-P-TR?
The SFM-149-02-S-D-A-P-TR is commonly deployed in FPGA mezzanine card (FMC/HPC) interfaces, software-defined radio daughter boards, high-speed data acquisition modules, and compact avionics I/O cards that require 98 signals at 1.27 mm pitch with a surface-mount footprint. Its high-reliability rating also suits mil-spec and aerospace applications where vibration resistance and repeatable contact performance over hundreds of mating cycles are specified.
What reflow soldering profile is the SFM-149-02-S-D-A-P-TR qualified for?
The SFM-149-02-S-D-A-P-TR is qualified for lead-free reflow soldering with a peak temperature of 260°C per JEDEC J-STD-020, allowing it to pass through a standard single-pass reflow oven together with other SMT components. No secondary low-temperature oven cycle is required, which simplifies PCB assembly scheduling and reduces per-board manufacturing cost in volume production.
How does tape-and-reel packaging affect minimum order quantities and assembly line integration for the SFM-149-02-S-D-A-P-TR?
The -TR suffix confirms tape-and-reel packaging, which is standard for automated SMT feeders and typically implies a minimum reel quantity of 250 to 1000 pieces depending on the feeder format. Reel packaging eliminates manual placement, reduces connector misalignment defects on the 1.27 mm pitch pads, and is compatible with standard 8 mm or 12 mm tape feeders used in most high-speed pick-and-place machines, keeping per-unit placement cycle times under 1 second.
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