SFM-148-L2-S-D-A-P-TR SAMTEC Connector (Other) In Stock
SFM-148-L2-S-D-A-P-TR is a 96-position dual-row high-reliability surface-mount socket strip from Samtec with a 1.27 mm (0.050 inch) pitch, designed for compact board-to-board connections. It features gold-plated contacts for reliable signal integrity and is supplied in tape-and-reel format for automated assembly. From stock, worldwide shipping available.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 96
- Lifecycle
- ACTIVE
- Datasheet
- SFM-148-L2-S-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-148-L2-S-D-A-P-TR?
- 96-position dual-row layout at 1.27 mm (0.050 inch) pitch enabling very high-density SMT signal interconnect
- High-reliability socket design with gold-plated contacts for low contact resistance and long mating cycle life
- Surface-mount termination compatible with reflow soldering for automated PCB assembly
- Tape-and-reel (TR) packaging supporting high-volume pick-and-place manufacturing
- Dual-row configuration minimizes PCB real estate compared to single-row solutions handling the same 96-signal count
What is SFM-148-L2-S-D-A-P-TR used for?
The SFM-148-L2-S-D-A-P-TR is used in high-density board-to-board interconnect applications such as embedded computing modules, FPGA daughter cards, and test fixture interfaces where 96 signals must be routed in a 1.27 mm pitch SMT footprint. Its high-reliability construction makes it suitable for aerospace, defense, and industrial electronics requiring extended mating cycle endurance. The tape-and-reel delivery enables efficient automated assembly in high-volume production environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-148-L2-S-D-A-P-TR datasheet?
SFM-148-L2-S-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-148-L2-S-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact pitch and position count does the SFM-148-L2-S-D-A-P-TR offer, and how dense is its layout?
The SFM-148-L2-S-D-A-P-TR provides 96 contact positions in a dual-row arrangement at a 1.27 mm (0.050 inch) pitch. This fine pitch halves the board space of an equivalent 2.54 mm pitch connector, making it ideal for compact PCB designs in FPGA modules, embedded computing boards, and aerospace electronics where high signal density is critical.
How does the SFM-148-L2-S-D-A-P-TR achieve high reliability, and what applications benefit from its construction?
The SFM-148-L2-S-D-A-P-TR uses gold-plated contacts and a robust SMT socket design rated for high mating cycle counts. This high-reliability construction supports applications in defense electronics, industrial control systems, and test-and-measurement equipment where connector failure over thousands of insertion cycles would be unacceptable. The gold plating ensures stable contact resistance below 20 milliohms across the 96 positions.
Is the SFM-148-L2-S-D-A-P-TR suitable for automated high-volume PCB assembly, and how is it packaged?
Yes, the SFM-148-L2-S-D-A-P-TR is supplied in tape-and-reel (TR) format, making it directly compatible with automated pick-and-place machines and standard SMT reflow soldering processes. The surface-mount termination with 1.27 mm pitch contacts allows precise robotic placement across all 96 positions, supporting consistent quality in high-volume production runs for telecom, industrial, and embedded computing hardware.
What is the row configuration of the SFM-148-L2-S-D-A-P-TR, and when is a dual-row layout preferred over a single-row design?
The SFM-148-L2-S-D-A-P-TR uses a dual-row layout, which arranges 96 contacts across 2 rows of 48 pins each at a 1.27 mm pitch. A dual-row design is preferred when total pin count requirements exceed what a practical single-row length can provide, or when the PCB length constraint forces a shorter but wider connector footprint. This configuration is common in FPGA expansion headers, DDR memory modules, and compact embedded system interconnects.
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