SFM-148-L2-S-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-148-L2-S-D-A-K-TR is a 96-position dual-row high-reliability surface-mount socket strip with 0.050 inch pitch, low-profile mount, gold contacts, and tape-and-reel packaging. From $9.00 in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 96
- Lifecycle
- ACTIVE
- Datasheet
- SFM-148-L2-S-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-148-L2-S-D-A-K-TR?
- 96-position dual-row SMT socket at 0.050 inch (1.27 mm) pitch with low-profile (L) mount minimizing PCB stack height in compact high-density board-to-board designs
- Gold-plated (A suffix) contacts delivering contact resistance below 20 mΩ and reliable mating performance over 500+ cycles for high-reliability embedded systems
- Tape-and-reel (TR) and pick-and-place (K) packaging enabling fully automated SMT assembly with reflow compatibility up to 260°C peak temperature
What is SFM-148-L2-S-D-A-K-TR used for?
The SAMTEC SFM-148-L2-S-D-A-K-TR is designed for high-density low-profile mezzanine interconnects in compact server modules, advanced embedded computing platforms, and FPGA daughter card assemblies requiring 96 signal connections at 0.050 inch pitch. Its low-profile mount reduces overall board stack height compared to standard variants, improving thermal management in slim-form-factor enclosures. The pick-and-place and tape-and-reel packaging supports fully automated high-volume SMT production for telecommunications and industrial equipment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-148-L2-S-D-A-K-TR datasheet?
SFM-148-L2-S-D-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-148-L2-S-D-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the low-profile (L) mount of the SFM-148-L2-S-D-A-K-TR benefit compact embedded system designs?
The low-profile (L suffix) mount on the SFM-148-L2-S-D-A-K-TR reduces the stand-off height between mated PCBs compared to standard or high-profile SFM variants, typically keeping the mezzanine stack under 4 mm total height. This is essential for slim-form-factor embedded modules such as COM Express Type 6 or custom SoC carrier boards where the total system height must stay within a 10 mm chassis clearance while still routing 96 signals at 0.050 inch pitch.
What automated assembly options does the SFM-148-L2-S-D-A-K-TR packaging support?
The K suffix indicates pick-and-place compatible packaging and the TR suffix indicates tape-and-reel format, enabling the SFM-148-L2-S-D-A-K-TR to be placed by standard SMT pick-and-place machines on reels holding hundreds of units. The surface-mount body supports reflow soldering at up to 260°C peak, compatible with SAC305 lead-free solder, making it suitable for fully automated high-throughput assembly lines producing boards with 96-position dual-row 0.050 inch pitch socket footprints.
How many signal pairs can be routed through the SFM-148-L2-S-D-A-K-TR in a differential signal design?
The SFM-148-L2-S-D-A-K-TR provides 96 positions in a dual-row layout at 0.050 inch (1.27 mm) pitch, supporting up to 48 differential signal pairs when adjacent contacts are assigned as pair lanes. This capacity handles 4 lanes of PCIe Gen 3 (each at 8 Gbps), multiple SERDES channels, or wide LVDS buses in FPGA-to-carrier board interconnects, while leaving contacts available for power and ground distribution.
When should an engineer choose the SFM-148-L2-S-D-A-K-TR over the SFM-148-02-H-D-A-P for a server module design?
The SFM-148-L2-S-D-A-K-TR with its low-profile mount is preferred over the SFM-148-02-H-D-A-P high-profile variant when the server module chassis limits vertical clearance to less than 5 mm between stacked boards. The L mount reduces stack height by approximately 3 mm to 5 mm compared to the H mount, which matters in 1U server blades and dense multi-board enclosures where airflow design restricts board-to-board spacing.
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