SFM-148-L2-H-D-A SAMTEC Connector (Other) In Stock
The SFM-148-L2-H-D-A is a 96-position dual-row high-reliability surface-mount socket strip from SAMTEC with 0.050" (1.27 mm) pitch for dense mezzanine and board-to-board signal interconnects. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 96
- Lifecycle
- ACTIVE
- Datasheet
- SFM-148-L2-H-D-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 96-position dual-row layout at 0.050 inch (1.27 mm) pitch supporting high pin-count FPGA, DSP, and processor mezzanine interfaces in minimal PCB footprint
- Surface-mount termination enabling automated reflow soldering at standard 260°C peak profiles for high-volume production compatibility
- High-reliability SAMTEC SFM series design with controlled-depth housing that ensures consistent mating depth and contact normal force across all 96 positions
Applications
The SFM-148-L2-H-D-A is used in high-density mezzanine and daughter-card applications such as FPGA expansion modules, memory interface boards, and signal-processing plug-in cards where a 96-position 0.050-inch pitch socket is required. Its dual-row surface-mount configuration supports wide parallel buses and mixed signal-and-power assignments on compact multi-layer PCBs used in telecom line cards, radar signal processors, and data-acquisition systems.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pin count and row configuration does the SFM-148-L2-H-D-A provide for high-density FPGA expansion designs?
The SFM-148-L2-H-D-A provides 96 contacts arranged in a dual-row configuration, with 48 positions per row at 0.050 inch (1.27 mm) pitch. This density allows a single connector to carry simultaneous data, address, control, and power assignments for wide-bus FPGA or DSP interfaces without the board area overhead of lower-pitch connectors.
How does the 0.050 inch pitch of the SFM-148-L2-H-D-A compare to 0.100 inch alternatives in terms of PCB area savings?
At 0.050 inch (1.27 mm) pitch, the SFM-148-L2-H-D-A occupies roughly half the board length of an equivalent 0.100 inch (2.54 mm) pitch connector for the same 96-position count. This approximately 50% footprint reduction is critical in constrained layouts like 3U or 6U VME and VPX form factors, or FPGA development boards where connector placement must accommodate nearby component clearances.
Can the SFM-148-L2-H-D-A withstand standard reflow soldering processes used in automated PCB assembly?
Yes. The SFM-148-L2-H-D-A uses surface-mount termination compatible with standard lead-free reflow soldering at peak temperatures up to 260°C. This makes it fully processable in automated SMT assembly lines without hand-soldering or selective soldering fixtures, and the 96-position dual-row housing is dimensioned to remain stable under typical reflow thermal profiles.
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