SFM-148-02-H-D-LC SAMTEC Connector (Other) In Stock
The SFM-148-02-H-D-LC is a SAMTEC 96-position dual-row high-reliability socket strip with 0.050" (1.27 mm) pitch in a surface mount package for fine-pitch board-to-board interconnect. Available from stock for worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 96
- Lifecycle
- ACTIVE
- Datasheet
- SFM-148-02-H-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-148-02-H-D-LC?
- 96-position dual-row layout at 0.050" (1.27 mm) pitch delivers high-density signal connectivity in a small PCB footprint
- High-reliability socket strip construction with H-series contacts rated for repeated mating cycles in demanding environments
- Surface mount termination style enables automated reflow soldering at 260°C peak for high-volume production
- LC (low-clearance) option minimizes mated stack height for slim embedded computing and instrumentation modules
What is SFM-148-02-H-D-LC used for?
The SFM-148-02-H-D-LC is designed for board-to-board and module-to-backplane signal interconnect in embedded computing, FPGA development boards, and high-density test and measurement equipment. Its 0.050" pitch and 96-position dual-row layout allow designers to route up to 96 signals across a compact 2.4-inch span while maintaining high contact reliability. The surface mount LC profile is especially suited for slim ruggedized systems in aerospace and industrial automation where vertical clearance is critical.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-148-02-H-D-LC datasheet?
SFM-148-02-H-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-148-02-H-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does the SFM-148-02-H-D-LC provide, and what pitch separates adjacent contacts?
The SFM-148-02-H-D-LC provides 96 positions arranged across 2 rows with a 0.050" (1.27 mm) contact pitch. This fine-pitch dual-row arrangement allows up to 96 individual signal connections within a mated footprint of approximately 2.4 inches, making it suitable for high-density FPGA and embedded computing interfaces.
In which assembly process does the SFM-148-02-H-D-LC perform best, and what soldering temperature applies?
The SFM-148-02-H-D-LC is optimized for surface mount technology (SMT) assembly using automated pick-and-place followed by reflow soldering, with a peak temperature of 260°C typical for Pb-free profiles. The SMT termination eliminates through-hole drilling, reducing PCB fabrication complexity in fine-pitch 0.050" board-to-board designs.
When would an engineer choose the SFM-148-02-H-D-LC over a standard 0.100" pitch socket strip?
An engineer should choose the SFM-148-02-H-D-LC when board space requires a 0.050" (1.27 mm) pitch instead of the standard 0.100" (2.54 mm) pitch, effectively halving the connector footprint for the same 96-position count. This trade-off is common in FPGA mezzanine cards, high-speed backplanes, and compact industrial controllers where PCB area is at a premium.
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