SFM-148-02-FM-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-148-02-FM-D-A-P-TR is a 96-position dual-row high-reliability surface mount socket strip with 0.050" (1.27 mm) pitch. Features flush-mount (FM) housing and tape-and-reel packaging for automated SMT assembly. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 96
- Lifecycle
- ACTIVE
- Datasheet
- SFM-148-02-FM-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-148-02-FM-D-A-P-TR?
- 96-position dual-row socket at 0.050" (1.27 mm) pitch enabling high-density mezzanine and FPGA daughter card interconnects
- Flush-mount (FM) housing variant providing a co-planar connector surface for low-profile board-to-board stacking
- High-reliability contact system rated for thousands of mating cycles in demanding aerospace and telecom environments
- Tape-and-reel (TR) packaging compatible with standard SMT pick-and-place equipment for high-volume automated assembly
- Anti-rotation peg design (A suffix) preventing connector misalignment during reflow soldering at up to 260°C
What is SFM-148-02-FM-D-A-P-TR used for?
The SFM-148-02-FM-D-A-P-TR is designed for high-density board-to-board interconnect in telecommunications line cards, FPGA compute mezzanine modules, and defense electronics requiring 96 reliable signal positions at a compact 1.27 mm pitch. Its flush-mount housing variant maintains a minimal board-to-board gap while the anti-rotation peg prevents connector shifting during automated reflow assembly. The tape-and-reel packaging makes it ideal for high-volume SMT production lines assembling complex multi-board embedded systems.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-148-02-FM-D-A-P-TR datasheet?
SFM-148-02-FM-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-148-02-FM-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the position count and pitch of the SFM-148-02-FM-D-A-P-TR, and what signal density does it achieve?
The SFM-148-02-FM-D-A-P-TR provides 96 total positions in a dual-row layout (48 per row) at a 0.050" (1.27 mm) pitch, achieving a signal density of approximately 1 contact per 1.27 mm of connector length. This high density is suitable for FPGA mezzanine cards and line card backplanes where maximum signal count per unit board length is critical.
How does the flush-mount (FM) housing of the SFM-148-02-FM-D-A-P-TR benefit low-profile board stacking designs?
The flush-mount (FM) housing positions the connector body co-planar with the PCB surface, reducing the mated board-to-board stack height compared to standard raised-body socket strips. For compact embedded computing modules requiring a board separation of less than 5 mm, the FM variant enables tighter stacking while maintaining reliable 96-position contact engagement at 1.27 mm pitch.
What role does the anti-rotation peg (A suffix) play in the automated SMT assembly of the SFM-148-02-FM-D-A-P-TR?
The anti-rotation peg (A suffix) is a mechanical post that locates into a PCB hole, preventing the connector from rotating or shifting on the pad pattern during reflow soldering at up to 260°C. For a 96-position connector body spanning approximately 61 mm, this alignment feature is essential to maintain pad-to-contact registration within 0.1 mm across all 96 solder joints during the reflow cycle.
When should the SFM-148-02-FM-D-A-P-TR be chosen over the SFM-148-T2-LM-D-A-P-TR for the same 96-position application?
The SFM-148-02-FM-D-A-P-TR should be chosen when a flush-mount profile is required and automated tape-and-reel assembly is the primary production method, as both the FM housing and TR packaging are optimized for pick-and-place lines handling the 1.27 mm pitch, 96-position format. The SFM-148-T2-LM-D-A-P-TR's T2 stack height and LM anti-wicking contact are better suited when a specific elevated board separation or solder-wicking prevention is the design priority.
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