SFM-147-T2-LM-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-147-T2-LM-D-A-K is a 94-position, dual-row, high-reliability surface mount socket strip with 0.050" (1.27 mm) pitch designed for high-density board-to-board and mezzanine interconnect applications. It features gold-plated contacts for low contact resistance and superior mating reliability. Available in stock worldwide with competitive pricing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 94
- Lifecycle
- ACTIVE
- Datasheet
- SFM-147-T2-LM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 94-position dual-row layout with 0.050" (1.27 mm) pitch for high-density interconnect solutions
- High-reliability surface mount design with gold-plated contacts for low resistance and extended cycle life
- Compatible with SAMTEC SFM high-reliability socket strip series supporting secure mezzanine and board-to-board stacking
Applications
The SFM-147-T2-LM-D-A-K is ideal for high-density mezzanine board stacking in telecommunications and networking equipment where space is limited and 94 signal connections are required in a compact 0.050" pitch footprint. It is also used in industrial control systems, test and measurement platforms, and embedded computing modules that demand reliable surface mount connectors with gold-plated contacts for thousands of mating cycles.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the SFM-147-T2-LM-D-A-K provide, and what pitch spacing does it use?
The SFM-147-T2-LM-D-A-K provides 94 positions arranged in a dual-row configuration with a 0.050" (1.27 mm) pitch spacing. This compact pitch allows high-density signal routing in a minimal PCB footprint, making it well suited for mezzanine and board-to-board stacking applications where channel count and space efficiency are both critical.
Which mezzanine stacking scenarios benefit most from using the SFM-147-T2-LM-D-A-K rather than a lower pin-count alternative?
Applications requiring 94 simultaneous signal or power connections in a surface mount mezzanine configuration benefit most, such as FPGA daughter card interfaces, high-speed data acquisition boards, and modular industrial controllers. The dual-row 0.050" pitch design delivers a significant wiring density advantage over 0.100" pitch alternatives while maintaining a standard SMT assembly process.
What contact finish does the SFM-147-T2-LM-D-A-K use, and how does it affect long-term reliability?
The SFM-147-T2-LM-D-A-K uses gold-plated contacts over a nickel underplate, providing low and stable contact resistance over thousands of mating cycles. Gold plating resists oxidation and fretting corrosion even in humid or mildly corrosive environments, extending the connector's service life in demanding applications such as test fixtures or frequently reconfigured modular systems that require 94-pin reliable connectivity.
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