SFM-147-T2-H-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-147-T2-H-D-A-K is a 94-position dual-row high-reliability surface mount socket strip with 1.27 mm (0.050 inch) pitch. Contacts are gold-plated and rated at 1A per pin, supporting high-cycle board-to-board mating in demanding applications. Stocked at global distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 94
- Lifecycle
- ACTIVE
- Datasheet
- SFM-147-T2-H-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 94-position dual-row layout at 1.27 mm (0.050") pitch providing high signal density for FPGA, processor, and mezzanine interconnect designs
- Gold-plated contacts rated 1A per pin with high-reliability construction rated for 100+ mating cycles in production and field environments
- -K kinked pin option improves contact coplanarity for automated SMT pick-and-place and 260°C reflow soldering compatibility
Applications
The SFM-147-T2-H-D-A-K is designed for high-density board-to-board stacking in FPGA evaluation boards, processor mezzanine modules, and telecom line cards that require 94 reliable signal connections at 1.27 mm pitch. Its kinked lead -K option and gold contacts make it a reliable component in high-volume automated assembly and field-serviceable systems that undergo repeated connect and disconnect cycles.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the -T2 and -H option in SFM-147-T2-H-D-A-K affect the stacking height of a board-to-board connection?
In SAMTEC's SFM series naming, the -T2 designates a specific tail length option and -H indicates an extended housing height, together determining the board-to-board stacking distance. For SFM-147-T2-H-D-A-K, this configuration typically results in a mated stack height of approximately 8 mm to 12 mm, accommodating components on the inner PCB face within that clearance.
What is the current rating per pin and total position count of the SFM-147-T2-H-D-A-K?
The SFM-147-T2-H-D-A-K provides 94 positions in a dual-row 1.27 mm pitch layout, with each gold-plated contact rated at 1A continuous current. This allows simultaneous routing of both signal lines and low-current power rails across the 94-pin interface without exceeding thermal limits.
For a processor daughterboard that requires 90+ signal connections, why choose SFM-147-T2-H-D-A-K over a 2.54 mm pitch socket?
At 1.27 mm pitch, the SFM-147-T2-H-D-A-K fits 94 positions in approximately 60 mm, whereas a 2.54 mm pitch equivalent would need over 120 mm for the same count. The 50% reduction in connector footprint length is critical in compact embedded processor boards where PCB area is limited.
Is SFM-147-T2-H-D-A-K suitable for automated SMT assembly, and what reflow temperature does it tolerate?
Yes, the SFM-147-T2-H-D-A-K is designed for surface mount automated assembly with a peak reflow temperature tolerance of 260°C, complying with JEDEC J-STD-020. The -K kinked pin option enhances coplanarity, reducing the risk of lifted contacts during reflow and improving first-pass solder joint yield.
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