SFM-147-L2-STL-D-A-K SAMTEC Connector (Other) In Stock
SFM-147-L2-STL-D-A-K is a 94-position dual-row high-reliability surface-mount socket strip from SAMTEC at 0.050-inch (1.27 mm) pitch with low-profile contacts and solder-tail termination. Designed for high-density board-to-board mezzanine connections with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 94
- Lifecycle
- ACTIVE
- Datasheet
- SFM-147-L2-STL-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-147-L2-STL-D-A-K?
- 94-position dual-row layout at 0.050-inch pitch delivers 47 contacts per row for very high pin-count board-to-board connections in a compact footprint
- Low-profile (L2) contact design minimizes mated stack height enabling slim multi-board assemblies in space-constrained enclosures
- High-reliability rated socket ensures consistent electrical performance across thousands of mating cycles and vibration environments
- Solder-tail (STL) termination provides robust mechanical anchor to the PCB for resistance to pull-out forces in harsh environments
What is SFM-147-L2-STL-D-A-K used for?
The SFM-147-L2-STL-D-A-K is targeted at very high-density mezzanine card, FPGA daughter-card, and processor module interconnects in advanced computing, telecom, and defense electronics. Its 94-position dual-row layout at 1.27 mm pitch supports routing of high-speed differential pairs, power rails, and control signals through a single low-profile connector. The solder-tail and low-profile combination delivers mechanical robustness and minimal board separation for slim but rugged multi-board assemblies.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-147-L2-STL-D-A-K datasheet?
SFM-147-L2-STL-D-A-K Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-147-L2-STL-D-A-K?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many contacts does SFM-147-L2-STL-D-A-K provide and what configuration are they in?
The SFM-147-L2-STL-D-A-K has 94 total contacts in a dual-row arrangement with 47 pins per row at a 0.050-inch (1.27 mm) pitch. This very high contact count is suitable for complex FPGA daughter-card or processor module interfaces requiring simultaneous routing of multiple high-speed buses, power rails, and control signals between stacked boards in computing or telecom systems.
What does the L2 low-profile designation on SFM-147-L2-STL-D-A-K mean for mated assembly height?
The L2 designation indicates a second-level low-profile contact variant that reduces the connector's above-board height below that of the standard L1 low-profile, resulting in a smaller mated stack separation between paired boards. For engineers designing slim 5G telecom line cards or high-density server mezzanine modules, this allows the complete board stack to fit within a height budget of just a few millimeters above the main PCB surface.
How does the solder-tail (STL) termination of SFM-147-L2-STL-D-A-K differ from standard SMT pads in mechanical strength?
The STL solder-tail termination extends through-hole-like tails from the surface-mount body into plated via holes in the PCB, providing a mechanical anchor that resists pull-out forces far better than flat SMT pads alone. This is significant for a 94-pin connector in vibration-prone environments such as airborne electronics, military systems, or industrial machinery where mating insertion and extraction forces can laterally stress the connector-to-board solder joint.
Which mating plug header series is designed to pair with SFM-147-L2-STL-D-A-K for a complete mezzanine stack?
The SFM-147-L2-STL-D-A-K socket is designed to mate with the corresponding SAMTEC SFM plug header at 0.050-inch (1.27 mm) pitch in a 94-position dual-row configuration. The complete mated assembly achieves board-to-board separations that can range from approximately 8 mm to 20 mm depending on the selected header variant stack height, enabling flexible power and signal routing between FPGA, processor, and I/O expansion cards in modular system architectures.
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