SFM-147-L2-F-D-A SAMTEC Connector (Other) In Stock
SAMTEC SFM-147-L2-F-D-A is a 94-position dual-row high-reliability socket strip with 0.050-inch pitch for surface mount applications. It delivers robust high-density interconnect in a compact SMT footprint. Available in stock with competitive pricing and worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 94
- Lifecycle
- ACTIVE
- Datasheet
- SFM-147-L2-F-D-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 94-position dual-row configuration at 0.050-inch pitch delivering high-density interconnect in minimal board area
- High-reliability surface mount design rated for demanding environments with consistent contact integrity across all 94 positions
- SAMTEC precision manufacturing with tight positional tolerance for accurate mating with complementary header strips
Applications
The SFM-147-L2-F-D-A is ideal for high-density board-to-board and mezzanine interconnect applications in telecommunications, industrial control, and defense electronics where space is at a premium. Its 0.050-inch pitch dual-row layout supports 94 signal positions in a compact SMT footprint, making it suitable for FPGA daughtercard interfaces and high-speed backplane expansion modules. Engineers use this connector in test and measurement equipment and server blade interconnects requiring reliable repeated mating cycles.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many contact positions does the SFM-147-L2-F-D-A provide and what is its pin pitch?
The SFM-147-L2-F-D-A provides 94 contact positions arranged in a dual-row layout at 0.050-inch (1.27 mm) pitch. This high-density configuration allows routing of many signals through a compact SMT footprint, reducing board space compared to larger-pitch connectors used in similar mezzanine interconnect roles.
Which board-to-board interface designs are best suited for the SFM-147-L2-F-D-A socket strip?
FPGA daughtercard expansions, mezzanine modules, and high-density backplane interfaces benefit most from the SFM-147-L2-F-D-A's 94-position dual-row layout at 0.050-inch pitch. Telecommunications line cards and defense electronics requiring reliable SMT socket strips in constrained PCB areas are typical use cases for this SAMTEC connector.
When does the SFM-147-L2-F-D-A outperform lower-density alternatives like 0.100-inch pitch sockets?
When board real estate is limited and signal count exceeds 50 pins, the SFM-147-L2-F-D-A's 0.050-inch pitch dual-row layout accommodates 94 positions in roughly half the PCB footprint of a 0.100-inch pitch socket. This makes it preferable for compact test fixture boards, server blades, and embedded compute modules where density is critical.
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