SFM-147-02-L-D-A-P SAMTEC Connector (Other) In Stock
The SFM-147-02-L-D-A-P is a 94-position dual-row high-reliability surface-mount socket strip from Samtec with 0.050 inch pitch and gold-plated contacts. It offers high-density interconnect for demanding mezzanine and expansion card designs. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 94
- Lifecycle
- ACTIVE
- Datasheet
- SFM-147-02-L-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-147-02-L-D-A-P?
- 94-position dual-row configuration at 0.050 inch (1.27 mm) pitch for very high signal density
- Gold-plated (A) contact finish for low contact resistance and extended mating cycle reliability
- Surface-mount termination enabling reflow-compatible automated assembly on standard PCB lines
- P (shrouded) housing provides mechanical keying and prevents mis-mating in high-density backplane designs
What is SFM-147-02-L-D-A-P used for?
The SFM-147-02-L-D-A-P is designed for high-density mezzanine interconnect in server blade modules, FPGA expansion cards, and rugged industrial computing systems that require 94 signal positions at a compact 0.050 inch pitch. Its gold-plated contacts deliver consistent electrical performance over thousands of mating cycles, making it suitable for field-replaceable modules and test fixtures. The surface-mount footprint integrates seamlessly into automated PCB assembly processes.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-147-02-L-D-A-P datasheet?
SFM-147-02-L-D-A-P Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-147-02-L-D-A-P?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the SFM-147-02-L-D-A-P carry and what pitch does it use?
The SFM-147-02-L-D-A-P carries 94 positions arranged in a dual-row layout at a 0.050 inch (1.27 mm) pitch, delivering a very high density interconnect solution that handles up to 94 independent signal or power lines within a compact PCB footprint.
What does the gold-plated contact finish contribute to the SFM-147-02-L-D-A-P's reliability?
The gold (A) contact finish provides a contact resistance below 20 milliohms and supports mating cycles exceeding 500 insertions, ensuring stable signal transmission at low-level currents while preventing oxidation in humid or corrosive environments found in industrial and server applications.
Which high-speed digital systems are best served by the SFM-147-02-L-D-A-P?
FPGA mezzanine boards, server expansion modules, and test-and-measurement backplanes routing 94 differential or single-ended signals benefit most, since the 0.050 inch pitch allows short trace lengths and controlled impedance routing at data rates up to several Gbps per channel.
Can the SFM-147-02-L-D-A-P be assembled using standard SMT reflow processes?
Yes, its surface-mount leads are compatible with standard lead-free reflow soldering at peak temperatures up to 260 degrees C, and the 02 series stand-off height allows sufficient solder paste volume under the connector body for reliable fillets during automated PCB assembly.
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About SAMTEC
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