SFM-146-L2-SM-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-146-L2-SM-D-A-K is a 92-position dual-row high-reliability socket strip with 0.050" (1.27 mm) pitch in a surface mount package. Designed for high-density board-to-board connections with robust mechanical retention and gold-plated contacts. Available worldwide with in-stock inventory.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 92
- Lifecycle
- ACTIVE
- Datasheet
- SFM-146-L2-SM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 92-position dual-row configuration with 0.050" (1.27 mm) pitch for high-density PCB layouts
- Surface mount termination for automated assembly compatibility and reliable solder joints
- Gold-plated contacts providing low contact resistance and high reliability in demanding applications
Applications
The SFM-146-L2-SM-D-A-K is suited for high-density board-to-board and mezzanine interconnect applications in telecommunications, data center switching, and instrumentation equipment. Its 0.050" pitch surface mount design enables compact, reliable connections in space-constrained PCB assemblies. Engineers also deploy this connector in industrial computing modules and embedded systems requiring 92 signal paths in a single component.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pitch and row configuration of the SFM-146-L2-SM-D-A-K?
The SFM-146-L2-SM-D-A-K features a 0.050" (1.27 mm) pitch dual-row layout with 92 total positions, providing 46 contacts per row. This fine pitch enables high-density signal routing within a compact footprint suitable for surface mount assembly on standard PCBs.
Which high-density interconnect applications benefit most from the SFM-146-L2-SM-D-A-K?
This connector excels in mezzanine board-to-board applications, telecommunications line cards, and FPGA-based data acquisition modules where 92 signal paths at 0.050" pitch are required. The surface mount termination withstands standard reflow soldering at up to 260°C peak temperatures, making it compatible with lead-free assembly processes.
How does the SFM-146-L2-SM-D-A-K compare to through-hole alternatives of similar pin count?
Compared to through-hole 92-position alternatives, the SFM-146-L2-SM-D-A-K occupies significantly less board space due to its 0.050" pitch surface mount design. The SMT footprint eliminates the need for drilled vias, freeing routing layers for signal integrity on multilayer PCBs with 6 or more copper layers in high-speed designs.
What mating connector is used with the SFM-146-L2-SM-D-A-K in a system assembly?
The SFM-146-L2-SM-D-A-K mates with SAMTEC corresponding pin header family at 0.050" pitch with matching 92-position dual-row configurations. The mated assembly provides approximately 2 mm stack height and supports data rates up to several GHz per channel depending on signal conditioning.
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