SFM-145-02-FM-D-LC SAMTEC Connector (Other) In Stock
SAMTEC SFM-145-02-FM-D-LC is a 90-position dual-row high-reliability socket strip with 1.27 mm (0.050 inch) pitch in a low-clearance surface mount configuration. Features precision-machined contacts and female mating interface for robust board-to-board connectivity. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 90
- Lifecycle
- ACTIVE
- Datasheet
- SFM-145-02-FM-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-145-02-FM-D-LC?
- 90-position dual-row layout at 1.27 mm (0.050") pitch delivering very high pin-count SMT interconnects in a single connector
- Low-clearance (LC) design for reduced mated height enabling compact stacked PCB configurations
- Female (FM) precision-machined socket contacts providing secure mating with matching header pins
- High-reliability construction suited for repeated mating cycles in defense and aerospace applications
What is SFM-145-02-FM-D-LC used for?
The SFM-145-02-FM-D-LC is used in high-density FPGA mezzanine boards, complex backplane systems, and modular data acquisition platforms requiring 90-pin dual-row connectivity at 1.27 mm pitch. Its low-clearance female socket design supports tightly stacked board pairs in ruggedized embedded systems and signal processing modules. The surface mount footprint enables integration into modern SMT production workflows for telecommunications and industrial automation hardware.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-145-02-FM-D-LC datasheet?
SFM-145-02-FM-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-145-02-FM-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 90-position count of SFM-145-02-FM-D-LC support high-density FPGA mezzanine designs?
With 90 positions in a dual-row layout at 1.27 mm pitch, the SFM-145-02-FM-D-LC provides 45 contacts per row, supporting FPGA I/O banks that require 80 or more signal lines per connector site. This allows FPGA mezzanine cards to route multiple high-speed interfaces including LVDS pairs, power rails, and control signals through a single compact 57 mm footprint.
What mated height does the SFM-145-02-FM-D-LC low-clearance version achieve in a board stack?
The low-clearance (LC) version of SFM-145-02-FM-D-LC achieves a mated stack height typically under 4 mm above the PCB surface, enabling board-to-board separation of approximately 5 mm in compact module assemblies. This is beneficial in avionics and mil-spec enclosures where inter-card spacing is limited to 6 mm to 8 mm.
When should a designer prefer SFM-145-02-FM-D-LC over a 90-position through-hole socket strip?
A designer should choose SFM-145-02-FM-D-LC when the PCB uses full SMT reflow soldering processes without through-hole wave soldering, reducing manufacturing steps for high pin-count connectors. The 1.27 mm pitch SMT footprint also saves approximately 40% PCB area compared to equivalent 2.54 mm through-hole dual-row socket strips with the same 90-pin count.
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