SFM-144-T2-H-D-A-K SAMTEC Connector (Other) In Stock
The SFM-144-T2-H-D-A-K from Samtec is a high-reliability 88-position dual-row surface-mount socket strip with 0.050" pitch designed for dense signal interconnect. It features gold-plated contacts for reliable mating and a compact SMT footprint suitable for automated assembly. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 88
- Lifecycle
- ACTIVE
- Datasheet
- SFM-144-T2-H-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 88 positions in a dual-row layout at 0.050" pitch enabling high-density signal routing on compact PCBs
- High-reliability gold-plated contacts ensuring stable electrical performance across thousands of mating cycles
- Surface-mount termination compatible with standard SMT reflow assembly processes for high-volume production
Applications
The SFM-144-T2-H-D-A-K is used in high-density board-to-board and module interconnect applications where 88 signals must be routed through a 0.050" pitch surface-mount socket. It is well suited for embedded computing modules, FPGA development boards, and high-speed data acquisition systems that require reliable, repeatable mating in automated assembly environments. The connector also serves as a high-reliability socket in test and measurement instruments where signal integrity and low contact resistance are critical.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and what pitch does the SFM-144-T2-H-D-A-K socket strip support?
The SFM-144-T2-H-D-A-K is an 88-position dual-row socket strip with a 0.050" pitch, enabling high-density signal routing in surface-mount PCB layouts for embedded computing and data acquisition applications.
For a high-speed FPGA module requiring 88 signal connections at 0.050" pitch, how does the SFM-144-T2-H-D-A-K handle signal integrity?
The gold-plated contacts of the SFM-144-T2-H-D-A-K provide low and consistent contact resistance across 88 pins at 0.050" pitch, minimizing signal reflections and maintaining reliable electrical connectivity for high-speed data paths on FPGA development boards.
Is the SFM-144-T2-H-D-A-K compatible with standard reflow soldering processes for high-volume PCB assembly?
Yes, the SFM-144-T2-H-D-A-K uses surface-mount termination pads compatible with standard SMT reflow processes at temperatures up to 260°C, supporting pick-and-place automated assembly and high-volume PCB manufacturing for embedded module interconnect.
When would SFM-144-T2-H-D-A-K be preferred over a through-hole socket strip in a test instrument design?
The SMT configuration of SFM-144-T2-H-D-A-K saves approximately 30% to 50% board area compared to through-hole alternatives and eliminates the need for wave-soldering, making it preferable for test instruments where PCB space is limited and automated SMT assembly is used.
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