SFM-144-02-LM-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-144-02-LM-D-A-K is an 88-position dual-row surface mount socket strip with 0.050" (1.27 mm) pitch, providing high-reliability mating for dense board interconnects. Ideal for FPGA mezzanine, server, and communications boards demanding high signal density.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 88
- Lifecycle
- ACTIVE
- Datasheet
- SFM-144-02-LM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 88-position dual-row SMT layout at 0.050" (1.27 mm) pitch for maximum signal density in compact PCB designs
- High-reliability SAMTEC socket strip construction rated for extended mating cycles under demanding operating conditions
- Surface mount termination enables reflow soldering integration into standard SMT assembly workflows
Applications
The SFM-144-02-LM-D-A-K is designed for high signal-count board-to-board connections in FPGA daughter cards, server mezzanine modules, and telecommunications line cards. Its 88-position dual-row 0.050" pitch format delivers up to 88 signal paths in a compact SMT footprint, making it the preferred choice when routing constraints prohibit larger-pitch alternatives.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does the SFM-144-02-LM-D-A-K provide and at what pitch?
The SFM-144-02-LM-D-A-K offers 88 positions in a dual-row layout with a 0.050" (1.27 mm) pitch, delivering 44 contacts per row. This high-density configuration is well suited for FPGA mezzanine cards and multi-channel data acquisition boards that require 80 or more signal connections in a surface mount package.
How does the SFM-144-02-LM-D-A-K compare to 0.100" pitch alternatives for high-density board stacking?
At 0.050" (1.27 mm) pitch, the SFM-144-02-LM-D-A-K provides roughly twice the contact density of comparable 0.100" pitch dual-row sockets. For an 88-position interface, it occupies approximately 50% less board length, which is critical on server blade and mezzanine form factors where every millimeter of PCB space is constrained.
What board-level assembly method is recommended for the SAMTEC SFM-144-02-LM-D-A-K?
The SFM-144-02-LM-D-A-K is a surface mount component designed for reflow soldering. Its SMT footprint supports standard lead-free reflow profiles up to approximately 260°C peak, making it directly compatible with high-volume automated assembly lines handling 88-position dual-row connector placement.
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