SFM-144-02-F-D-A-P SAMTEC Connector (Other) In Stock

SAMTEC SFM-144-02-F-D-A-P is an 88-position dual-row high-reliability surface mount socket strip with 1.27 mm (0.050 inch) pitch. Designed for high pin-count mezzanine and daughter card interconnects requiring reliable SMT socket performance. Available from stock with worldwide shipping.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
SFM-144-02-F-D-A-POther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
88
Lifecycle
ACTIVE
Category
Connector
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of SFM-144-02-F-D-A-P?

  • 88-position dual-row fine-pitch socket at 1.27 mm (0.050 inch) pitch for high pin-count mezzanine board connections
  • High reliability (H) contact rating ensures stable contact resistance across extended mating cycles in demanding environments
  • Surface mount termination compatible with standard reflow soldering profiles up to 260°C for lead-free assembly
  • Dual-row layout provides 44 positions per row for simultaneous signal and power routing in a compact SMT footprint

What is SFM-144-02-F-D-A-P used for?

The SFM-144-02-F-D-A-P is designed for high pin-count mezzanine interconnects in FPGA daughter cards, high-speed data acquisition modules, and ruggedized embedded computing systems requiring 88 reliable contact points. Its 1.27 mm fine pitch supports dense signal routing between stacked boards in applications such as network interface cards and signal processing modules. The surface mount design enables automated assembly and eliminates through-hole drilling, reducing PCB fabrication complexity for large-format mezzanine connections.

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)

Where can I find the SFM-144-02-F-D-A-P datasheet?

SFM-144-02-F-D-A-P Datasheet Download

Official datasheet from SAMTEC

What are equivalent replacements for SFM-144-02-F-D-A-P?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How many contact positions does the SFM-144-02-F-D-A-P provide and how are they arranged across the two rows?

The SFM-144-02-F-D-A-P provides 88 total contact positions arranged as 44 positions per row in a dual-row layout at 1.27 mm (0.050 inch) pitch. This high position count allows simultaneous routing of numerous signal lines, ground pins, and power rails between a main board and a mezzanine daughter card in a single compact connector footprint.

For an FPGA daughter card design, how does the 1.27 mm pitch of SFM-144-02-F-D-A-P affect PCB routing density compared to 2.54 mm pitch alternatives?

At 1.27 mm (0.050 inch) pitch, the SFM-144-02-F-D-A-P requires approximately half the board length per row compared to a 2.54 mm pitch connector carrying the same 44 positions per row. This halved footprint length leaves more routing area on the FPGA daughter card for high-speed differential pairs and power planes, which is critical in dense FPGA-based data processing designs where routing congestion is a primary layout constraint.

What surface mount reflow compatibility does the SFM-144-02-F-D-A-P offer for lead-free PCB assembly processes?

The SFM-144-02-F-D-A-P is compatible with standard lead-free SMT reflow soldering profiles with peak temperatures up to 260°C. The SMT pads accept SAC305 or similar lead-free solder alloys, and the connector housing material is rated to withstand multiple reflow passes. This compatibility allows it to be placed alongside other SMT components in a single reflow cycle without requiring selective or hand soldering.

When would SFM-144-02-F-D-A-P be preferred over a through-hole socket strip in a ruggedized mezzanine assembly?

SFM-144-02-F-D-A-P is preferred when PCB thickness constraints or component density on the solder side of the board prevent through-hole drilling for 88 positions at 1.27 mm pitch. SMT placement also avoids solder wave thermal stress on other sensitive components and reduces board fabrication cost by eliminating 88 drilled and plated holes. In ruggedized assemblies where vibration loading is present, the SMT solder joints can be reinforced with adhesive underfill for additional mechanical retention.

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AvailabilityIn Stock
Reference Price (USD)
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In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

MR
Marco Rossi
CTO, AutoDrive Systems, Italy