SFM-143-T2-SM-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-143-T2-SM-D-A-P is an 86-position dual-row high-reliability socket strip with 1.27 mm (0.050") pitch, designed for surface mount board-to-board applications demanding high mating cycle life and signal integrity. Gold-plated contacts and precision molded housing ensure consistent performance across demanding environments.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 86
- Lifecycle
- ACTIVE
- Datasheet
- SFM-143-T2-SM-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-143-T2-SM-D-A-P?
- 86-position dual-row SMT socket strip at 1.27 mm (0.050") pitch for high-density interconnects
- High-reliability design rated for extended mating cycles, ideal for test and field-replaceable modules
- Gold-plated contact finish (A option) for superior corrosion resistance and low contact resistance
- Surface mount termination compatible with standard SMT reflow soldering at up to 260°C
- Dual-row (D) layout provides 43 contacts per row in a compact low-profile footprint
What is SFM-143-T2-SM-D-A-P used for?
SFM-143-T2-SM-D-A-P is suited for high-density board-to-board mating in FPGA mezzanine cards, ruggedized defense electronics, and high-speed data acquisition modules where 86 contacts at 1.27 mm pitch are required. Its gold-plated contacts and high-reliability socket construction make it a strong choice for applications involving frequent module swapping or long operational service life.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-143-T2-SM-D-A-P datasheet?
SFM-143-T2-SM-D-A-P Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-143-T2-SM-D-A-P?
Compatible alternatives and drop-in replacements for SFM-143-T2-SM-D-A-P:
Board Connector, 86 Contact(s), 2 Row(s), Female, Straight, 0.05 inch Pitch, Surface Mount Terminal, Black Insulator, Socket
Frequently Asked Questions
What is the contact pitch and total pin count of the SFM-143-T2-SM-D-A-P, and what mating density does it support?
The SFM-143-T2-SM-D-A-P features 86 positions on a 1.27 mm (0.050") pitch in a dual-row arrangement, providing 43 contacts per row. This fine pitch enables very high signal density within a compact SMT footprint, making it appropriate for FPGA daughtercard and high-speed data bus interconnects.
Why might an engineer choose the gold-plated contact option (-A) in this socket strip for field-replaceable module designs?
The -A contact finish indicates gold plating, which provides lower and more stable contact resistance—typically in the milliohm range—compared to tin or selective finishes. Gold plating is preferred for high-reliability and high-mating-cycle applications, such as field-swappable modules that may be inserted and removed dozens of times throughout a system's service life.
How does the SFM-143-T2-SM-D-A-P's 0.050" pitch compare to 0.100" pitch connectors for space-limited PCB designs?
At 1.27 mm (0.050") pitch, the SFM-143-T2-SM-D-A-P provides roughly twice the contact density of standard 2.54 mm (0.100") pitch connectors for the same board length. This makes it the preferred choice for compact FPGA carrier boards, mezzanine modules, and high-density signal routing applications where board real estate is at a premium.
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