SFM-143-T2-LM-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-143-T2-LM-D-A-P is an 86-position, dual-row, high-reliability socket strip with 0.050" (1.27 mm) pitch in surface mount configuration. It features low-mass, high-speed contacts designed for dense board-to-board interconnects. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 86
- Lifecycle
- ACTIVE
- Datasheet
- SFM-143-T2-LM-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-143-T2-LM-D-A-P?
- 86-position dual-row socket strip at 0.050" (1.27 mm) pitch for high-density applications
- High-reliability low-mass contacts engineered for signal integrity in high-speed designs
- Surface mount termination compatible with automated PCB assembly processes
- Compact 1.27 mm pitch enables space-saving board-to-board interconnection
What is SFM-143-T2-LM-D-A-P used for?
The SFM-143-T2-LM-D-A-P is designed for high-density board-to-board interconnect applications in telecommunications, computing, and advanced instrumentation. Its 0.050" pitch and 86-position dual-row configuration make it ideal for space-constrained designs such as mezzanine card stacking and processor module interconnects. High-reliability socket contacts also suit this part for defense and aerospace applications requiring robust signal performance at fine pitch.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-143-T2-LM-D-A-P datasheet?
SFM-143-T2-LM-D-A-P Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-143-T2-LM-D-A-P?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and pin count does SFM-143-T2-LM-D-A-P provide?
The SFM-143-T2-LM-D-A-P features 86 positions in a dual-row configuration with a 0.050" (1.27 mm) pitch, providing 43 pins per row. This fine pitch makes it suitable for high-density PCB interconnect designs where board space is at a premium and a large number of signal lines need to be routed.
How does the 0.050" pitch of SFM-143-T2-LM-D-A-P compare to 0.100" pitch alternatives for high-speed signal routing?
The 0.050" (1.27 mm) pitch of SFM-143-T2-LM-D-A-P delivers twice the connector density compared to standard 0.100" (2.54 mm) pitch alternatives. With 86 positions in the same board footprint as a 43-position 0.100" connector, it enables more signal lines per unit area, which is critical in high-speed board-to-board interconnect designs such as mezzanine modules and backplane assemblies.
Which application areas most benefit from using SFM-143-T2-LM-D-A-P in their PCB designs?
SFM-143-T2-LM-D-A-P is especially suited for high-density applications in computing, telecommunications, and aerospace electronics. Its 86-position dual-row 0.050" pitch socket strip supports mezzanine card stacking, FPGA and DSP module interconnects, and military-grade assemblies where both signal integrity and reliable connection quality across 1.27 mm pitch contacts are required.
Can SFM-143-T2-LM-D-A-P be used in automated SMT assembly lines?
Yes, the SFM-143-T2-LM-D-A-P is designed as a surface mount component compatible with standard SMT reflow assembly processes. Its 0.050" (1.27 mm) pitch and 86-position layout require precise pick-and-place placement, and the surface mount termination pads are compatible with standard PCB land patterns used in automated assembly of fine-pitch connectors.
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About SAMTEC
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