SFM-143-L2-SM-D-A SAMTEC Connector (Other) In Stock
SAMTEC SFM-143-L2-SM-D-A is an 86-position dual-row high-reliability surface mount socket strip with 0.050 inch (1.27 mm) pitch, engineered for dense SMT mezzanine and module interconnect applications. From $1.00 in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 86
- Lifecycle
- ACTIVE
- Datasheet
- SFM-143-L2-SM-D-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 86-position dual-row socket at 1.27 mm (0.050 inch) pitch delivers twice the contact density of 2.54 mm strips in the same PCB footprint
- High-reliability socket strip design with surface mount termination ensures strong solder joints and consistent insertion force across all 86 positions
- Dual-row SMT configuration supports mezzanine module interconnects with secure mechanical retention and minimal board height overhead
Applications
The SFM-143-L2-SM-D-A serves high-density mezzanine and daughter-card interconnect applications in embedded computing, RF modules, and medical instrumentation where board space is at a premium. Its 86-position dual-row layout at 1.27 mm pitch provides 86 independent signal or mixed-power connections within a very compact SMT footprint. The high-reliability socket construction suits environments with vibration or thermal cycling, such as aerospace test fixtures and industrial automation controllers.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and position count does the SFM-143-L2-SM-D-A offer, and how do they affect routing density?
The SFM-143-L2-SM-D-A has 86 positions on a 1.27 mm (0.050 inch) pitch in a dual-row layout, achieving a contact density of approximately 2 contacts per 2.54 mm of strip length — roughly double the density of standard 2.54 mm pitch connectors in the same PCB length.
For which mezzanine module form factors is the SFM-143-L2-SM-D-A a suitable socket solution?
The SFM-143-L2-SM-D-A is compatible with mezzanine headers following 1.27 mm dual-row footprints, including small form-factor compute modules and RF daughterboards requiring 86 I/O lines at board heights as low as a few millimeters above the PCB surface.
How does the L2 stack height designation of this connector influence PCB assembly clearance?
The L2 suffix denotes a specific mated stack height, typically on the order of 2 mm to 4 mm above the PCB surface, which constrains the daughter-card clearance. Designers must verify the mated height against chassis and adjacent component keep-out zones before finalizing the PCB layout.
What surface mount termination style does the SFM-143-L2-SM-D-A use and how does it affect soldering process selection?
The connector uses surface mount (SM) termination with gull-wing or J-lead style contacts compatible with standard reflow soldering at peak temperatures up to 260°C per IPC/JEDEC J-STD-020. This eliminates the need for wave soldering or hand soldering, supporting high-volume automated SMT assembly.
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