SFM-143-L2-H-D-A-P-TR SAMTEC Connector (Other) In Stock

What are the key features of SFM-143-L2-H-D-A-P-TR?

• 86 positions in a dual-row 1.27 mm (0.050 inch) pitch footprint delivering high pin density for mezzanine card and module interface applications
• Horizontal (H) surface-mount termination style enabling low-profile board-to-board connections for space-constrained enclosures
• High-reliability contact construction engineered for consistent signal integrity over hundreds of mating cycles at signal levels down to milliamp levels
• Tape-and-reel (TR) packaging enabling uninterrupted automated pick-and-place assembly in high-volume SMT production environments

What is SFM-143-L2-H-D-A-P-TR used for?

SFM-143-L2-H-D-A-P-TR serves as the mating socket in high-density mezzanine module interfaces, FPGA daughter card attachments, and RF front-end boards where 86 contacts on a 1.27 mm pitch minimize the footprint. Its horizontal termination style suits flat, low-clearance enclosures used in telecommunications line cards and compact embedded servers. The connector is also a common choice for aerospace and defence electronics requiring high-reliability interconnects that sustain performance through vibration and thermal cycling.

Compliance & Regulatory

Where can I find the SFM-143-L2-H-D-A-P-TR datasheet?

Official datasheet from SAMTEC

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