SFM-143-L2-H-D-A-K SAMTEC Connector (Other) In Stock
Samtec SFM-143-L2-H-D-A-K is an 86-position dual-row high-reliability surface mount socket strip with 0.050" pitch, featuring a low-profile housing for dense PCB stacking applications. Gold-plated spring contacts ensure consistent mating force and signal integrity. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 86
- Lifecycle
- ACTIVE
- Datasheet
- SFM-143-L2-H-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 86-position dual-row layout at 0.050" (1.27 mm) pitch enabling very high-density signal routing in compact SMT footprints
- High-reliability socket strip construction with enhanced contact retention for applications requiring extended mating cycles beyond 100 insertions
- Surface mount termination with L2 stacking height option supporting controlled board-to-board spacing in multi-board assemblies
Applications
The SFM-143-L2-H-D-A-K high-reliability socket strip is designed for dense board-to-board stacking in FPGA mezzanine cards, high-speed data acquisition modules, and ruggedized embedded computing systems. Its 0.050" pitch and 86-position dual-row configuration deliver up to 86 high-integrity signal channels within a minimal PCB footprint, supporting differential pair routing and ground-signal-ground arrangements.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What mating pitch and position count does SFM-143-L2-H-D-A-K provide for mezzanine card stacking?
The SFM-143-L2-H-D-A-K provides 86 positions in a dual-row configuration at 0.050" (1.27 mm) pitch. This fine pitch allows 86 independent signal channels in the same PCB area that a 0.100" pitch connector would use for only 43 positions, making it well suited for high-speed FPGA I/O expansion and mezzanine card interfaces where board space is critical.
How does the L2 stacking height option in SFM-143-L2-H-D-A-K affect board-to-board spacing in a stacked assembly?
The L2 designation specifies a defined stacking height that controls the board-to-board gap to approximately 8 mm when mated with the corresponding TSM or SSM series header. This fixed standoff allows designers to route cables, mount components, or install heat spreaders in the inter-board space, a common requirement in multi-board compute modules and ruggedized avionics systems.
In a high-cycle test fixture scenario, why is the high-reliability SFM-143-L2-H-D-A-K preferred over a standard socket strip?
Standard socket strips are rated for approximately 30 mating cycles, while the high-reliability SFM series is designed for greater than 100 mating cycles with gold-over-nickel contacts maintaining contact resistance below 20 milliohms throughout its rated life. For automated test equipment (ATE) fixtures that mate and unmate devices daily, this extended cycle rating directly reduces connector replacement frequency and downtime.
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